Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.296 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.376 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.864 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.432 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.752 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.744 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.696 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.328 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.872 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.992 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione4.800 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione4.848 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.272 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.992 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione4.336 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.152 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.808 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.824 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.536 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.472 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.672 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.968 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.968 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione4.320 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.360 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.912 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.360 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.000 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |