Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione2.000 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione4.928 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione2.528 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.576 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.416 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione4.944 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.320 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione3.552 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.184 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.696 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.152 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.872 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione4.880 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.952 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.856 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.424 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.440 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.088 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.392 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.856 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.872 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.040 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.472 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.048 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.776 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.632 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.312 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.448 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |