Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.824 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.016 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.432 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione4.960 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.960 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.248 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.640 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.840 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione3.584 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.088 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.200 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione7.168 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.672 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione7.216 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione4.928 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.688 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.648 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione2.976 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.264 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione4.800 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.528 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.712 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.040 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.928 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.880 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.976 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.800 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.464 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |