Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.840 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.376 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.280 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.176 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.208 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione4.000 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.176 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione3.104 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione4.224 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.904 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione6.912 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.520 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.024 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 16K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione6.080 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 16K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione4.224 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 16K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione3.488 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 4K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione5.168 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I²C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 4K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione6.144 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I²C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 4K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione3.792 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I²C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 16K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione3.040 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 16K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione5.168 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 16K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione2.384 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 4K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione3.328 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I²C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 4K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione4.560 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I²C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EERAM 4K I2C 1MHZ WAFER
|
pacchetto: Die |
Azione7.808 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I²C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.712 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione4.576 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K SPI 2MHZ WAFER
|
pacchetto: Die |
Azione5.568 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |