Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
64K SPI SERIAL EEPROM
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.752 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
64K SPI SERIAL EEPROM
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.288 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
64K SPI SERIAL EEPROM
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.640 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.176 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.616 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.752 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.360 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
32K-BIT SEEPROM DLM
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.880 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
32K 4KX8 2.5V SER EE HIGH TEMP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.472 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.680 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.944 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
32K 4KX8 2.5V SER EE HIGH TEMP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.808 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.312 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.840 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.104 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.504 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione2.928 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.704 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.504 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.776 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.784 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.456 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
pacchetto: 8-WFDFN Exposed Pad |
Azione3.344 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.424 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.192 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
pacchetto: 8-WFDFN Exposed Pad |
Azione3.712 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
16K 2KX8 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.384 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.792 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |