Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
16K 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.192 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
128K SPI SERIAL EEPROM W/ 64-BYT
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.808 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
128K SPI SERIAL EEPROM W/ 64-BYT
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.280 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
128K SPI SERIAL EEPROM W/ 64 BYT
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.920 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
128K SPI SERIAL EEPROM W/ 64-BYT
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.896 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1024K 128KX8 2.5V SER EE
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione6.992 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 20MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
1024K 128KX8 2.5V SER EE
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.512 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 20MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
8K 32B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.952 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 32B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.696 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 1KX8 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.064 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 16B PAGE 2.5V SER EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
8K 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.568 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 1KX8 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.896 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 16B PAGE 2.5V SER EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.720 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
8K 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.800 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4K 512X8 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.728 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4K 512X8 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.096 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4K 512X8 2.5V SER EE
|
pacchetto: SOT-23-6 |
Azione7.520 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
4K 512X8 2.5V SER EE
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.784 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
4K 512X8 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.800 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4K 512X8 2.5V SER EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.352 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4K 512X8 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.752 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X8 2.5V SER EE HIGH TEMP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.440 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.744 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X8 2.5V SER EE
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.016 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
2K 256X8 2.5V SER EE HIGH TEMP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.464 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.056 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1K 128X8 2.5V SER EE HIGH TEMP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.376 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |