Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
8K 1024X8 SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.104 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.360 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.096 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.184 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X16 SERIAL EE
|
pacchetto: SOT-23-6 |
Azione7.056 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
4K 256X16 SER EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.184 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4K 512X8 SERIAL EE IND
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.160 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4K 512X8 SERIAL EE IND
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.464 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.408 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.608 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X8 OR 128X16 SERIAL EE EXT
|
pacchetto: 8-VFDFN Exposed Pad |
Azione6.016 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.408 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.432 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.928 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1K 128X8 OR 64X16 SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.104 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.088 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1K 6F4X16 SERIAL EE
|
pacchetto: SOT-23-6 |
Azione2.368 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
1K 64X16 SERIAL EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.144 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.592 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.944 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 1024X16 SERIAL EE
|
pacchetto: SOT-23-6 |
Azione5.168 |
|
EEPROM | EEPROM | 16Kb (1K x 16) | SPI | 3MHz | 2ms | - | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
8K 512X16 OR 1024X8 SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.000 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: SOT-23-6 |
Azione4.000 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 2MHz | 2ms | - | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
1K 64X16 SERIAL EE AUTO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.624 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 3MHz | 2ms | - | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 512X16 OR 1024X8 SERIAL EE
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.000 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
8K 1024X8 SERIAL EE 1.8V IND.
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.800 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 3MHz | 5ms | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
64K SPI SERIAL EEPROM
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.512 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
64K SPI SERIAL EEPROM
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.696 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |