Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
128K 16KX8 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.608 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1024K 128KX8 2.5V SER EE 128 BYT
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.136 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1024K 128KX8 2.5V SER EE 128 BYT
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.112 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 1KX8 2.5V SERIAL EE IND
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione3.696 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
8K 1KX8 2.5V SERIAL EE IND
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.640 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 1KX8 2.5V SERIAL EE
|
pacchetto: SC-74A, SOT-753 |
Azione5.696 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
8K 1KX8 2.5V SERIAL EE IND
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.432 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
8K 1KX8 2.5V SERIAL EE IND
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.640 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4K 512X8 2.5V SERIAL EE IND
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.896 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4K 512X8 2.5V SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.040 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4K 512X8 2.5V SERIAL EE
|
pacchetto: SC-74A, SOT-753 |
Azione6.816 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
4K 512X8 2.5V SERIAL EE IND
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.672 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4K 512X8 2.5V SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.824 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X8 2.5V SERIAL EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.904 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
2K 256X8 2.5V SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.536 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X8 1.8V SERIAL EEPROM
|
pacchetto: SC-74A, SOT-753 |
Azione3.392 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
2K 256X8 2.5V SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.968 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K SEEPROM ADDRESSABLE MEMORY DE
|
pacchetto: 8-WFDFN Exposed Pad |
Azione5.072 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
2K SEEPROM ADDRESSABLE MEMORY DE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.808 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 400ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1K 128X8 2.5V SERIAL EE IND
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.992 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1K 2-WIRE SERIAL EEPROM
|
pacchetto: SC-74A, SOT-753 |
Azione7.264 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
512K 64KX8 1MHZ SER EE IND
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.480 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 1MHz | 5ms | 400ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
512K 64KX8 1MHZ SER EE IND
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.664 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 1MHz | 5ms | 400ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
512K 64KX8 1MHZ SER EE IND
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.256 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 1MHz | 5ms | 400ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.144 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 1MHz | 5ms | 400ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.608 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 1MHz | 5ms | 400ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
64K 8KX8 1.8V SER EE EXT
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.368 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
32K 4KX8 1.8V SERIAL EE EXT
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.552 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 100kHz | 5ms | 3.5µs | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |