Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 4:2 4.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione7.104 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 4:2 4.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione4.672 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:20 1.5GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione5.968 |
|
1 | 2:20 | Yes/Yes | CML, LVDS, PECL | LVDS | 1.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:20 2GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione5.520 |
|
1 | 2:20 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:10 2GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione4.768 |
|
2 | 2:10 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione4.112 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione7.136 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:2 6GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.960 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
pacchetto: 48-TQFP |
Azione4.752 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
pacchetto: 48-TQFP |
Azione5.136 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 750MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione2.928 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 750MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 750MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione6.744 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 750MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:4 6GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.864 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 4.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione3.968 |
|
1 | 1:4 | Yes/Yes | LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:8 1.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione28.620 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVDS | 1.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 7GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.968 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 7GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 5.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione7.168 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 7.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.040 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | CML | 7.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 5.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione2.688 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 4GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione6.976 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 6GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.056 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 6GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione3.440 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.848 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 8GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.664 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 4.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione4.016 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 235MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.264 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 235MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 235MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.920 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 235MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.072 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |