Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:2 2.5GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.744 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVCMOS, LVDS, LVTTL, PECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 33QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.784 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 33QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione3.584 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione3.136 |
|
1 | 2:5 | Yes/Yes | CML, LVDS, PECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.952 |
|
1 | 2:5 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione34.656 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.368 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
TRANSLATOR BUFFER, CMOS TO LVPEC
|
pacchetto: 8-SMD |
Azione6.896 |
|
- | - | - | - | - | - | - | - | Surface Mount | 8-SMD | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 16SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.608 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 16SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.392 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 33QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione7.248 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 33QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione16.056 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.864 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 16SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.752 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.520 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione6.352 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.472 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.97 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione5.696 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione9.648 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.97 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.376 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 3GHz | 2.375 V ~ 2.635 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.536 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione7.456 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.832 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione19.956 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 2.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione4.896 |
|
2 | 2:1 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 150MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione11.832 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.752 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.384 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |