Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione115.716 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.456 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione20.376 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.048 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.336 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.416 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.284 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.160 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione18.600 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.280 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.312 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.120 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione44.340 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.176 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.100 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.720 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione34.872 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.176 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione220.632 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.624 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.584 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.832 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.480 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.768 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.656 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.384 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione5.888 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:12 3GHZ 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione5.712 |
|
1 | 2:12 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |