Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLOCK BUFFER 1:1 170MHZ DIE
|
pacchetto: Die |
Azione4.272 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 170MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 170MHZ DIE
|
pacchetto: Die |
Azione4.480 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 170MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 160MHZ DIE
|
pacchetto: Die |
Azione5.008 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 160MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 160MHZ DIE
|
pacchetto: Die |
Azione4.288 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 160MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
pacchetto: Die |
Azione5.376 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 125MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
pacchetto: Die |
Azione4.688 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 125MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
pacchetto: Die |
Azione2.608 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 125MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 200MHZ DIE
|
pacchetto: Die |
Azione2.064 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 200MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 200MHZ DIE
|
pacchetto: Die |
Azione4.800 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 200MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLK MULTPLX
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.232 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 170MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK MULTPLX
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.312 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 170MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 40MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione3.792 |
|
1 | 1:2 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
pacchetto: - |
Azione7.920 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
pacchetto: - |
Azione4.864 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione7.344 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |