Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione2.944 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 16WQFN
|
pacchetto: 16-VFQFN |
Azione6.720 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.848 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.816 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
pacchetto: - |
Azione4.352 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 150MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione3.792 |
|
1 | 1:2 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione4.352 |
|
1 | 1:9 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:10 2GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione35.700 |
|
2 | 2:10 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:4 5.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.304 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione53.400 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione14.736 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOP
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.928 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
HIGH SPEED TRANSLATOR BUFFER TO
|
pacchetto: 16-VFQFN |
Azione10.680 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione49.620 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:5 134MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.544 |
|
1 | 1:5 | No/No | CMOS | CMOS | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione174.420 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione23.244 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione24.792 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione4.672 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione5.648 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 4.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione8.412 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 3GHZ 8MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione3.392 |
|
1 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.872 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2GHz | 2.37 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione5.040 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione3.008 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione215.184 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.156 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione22.200 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |