Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP 100-TQFP
|
pacchetto: 100-LQFP |
Azione3.312 |
|
Parallel, PCM, Serial | 1 | - | - | - | - | Surface Mount | 100-LQFP | PG-TQFP-100 |
||
Infineon Technologies |
IC SLIC VOICE ACCESS PDSO-20
|
pacchetto: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Azione5.728 |
|
IOM-2, PCM | 2 | 5V | 105mA | - | - | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
||
Infineon Technologies |
IC SLIC VOICE ACCESS VQFN-48
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.712 |
|
IOM-2, PCM | 2 | 3.3 V ~ 5 V | 105mA | - | - | Surface Mount | 48-VFQFN Exposed Pad | PG-VQFN-48-4 |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.200 |
|
- | 1 | 4.5 V ~ 5.5 V | 90mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Maxim Integrated |
IC FRAMER QUAD DS3/E3 144TCBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione3.968 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-CSPBGA (13x13) |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V/5V 49-BGA
|
pacchetto: 49-LFBGA, CSPBGA |
Azione4.448 |
|
LIU | 1 | 4.75 V ~ 5.25 V | 95mA | - | -40°C ~ 85°C | Surface Mount | 49-LFBGA, CSPBGA | 49-CSBGA (7x7) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione2.176 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Maxim Integrated |
IC LIU E1/T1/J1 QUAD 5V 144-BGA
|
pacchetto: 144-BBGA |
Azione7.944 |
|
LIU | - | 4.75 V ~ 5.25 V | 95mA | - | 0°C ~ 70°C | Surface Mount | 144-BBGA | 144-PBGA (17x17) |
||
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 552BGA
|
pacchetto: 552-BGA |
Azione16.404 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
NXP |
IC C2K 1.2GHZ 8CH VOIP 625BGA
|
pacchetto: - |
Azione4.672 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC DAA ENH GLOB LINE-SIDE 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione3.488 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.560 |
|
- | 1 | 4.5 V ~ 5.5 V | - | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8 FLTPK
|
pacchetto: 8-ESOP (0.250", 6.35mm Width) |
Azione5.200 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-ESOP (0.250", 6.35mm Width) | 8-Flatpack |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8FLTPK
|
pacchetto: 8-SMD, Gull Wing |
Azione4.032 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
IXYS Integrated Circuits Division |
IC LITELINK III HALF RING 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione61.092 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Broadcom Limited |
INTEGRATED GBE CONTROLLER
|
pacchetto: 676-BGA |
Azione6.784 |
|
PCI | 2 | - | - | - | - | Surface Mount | 676-BGA | 676-PBGA (27x27) |
||
Microsemi Corporation |
20G VT/TU SWITCHING ELEMENT
|
pacchetto: 672-BGA, FCBGA |
Azione4.672 |
|
Serial | 1 | - | - | - | - | Surface Mount | 672-BGA, FCBGA | 672-FCBGA (27x27) |
||
Microchip Technology |
IC ETHERNET CLK OUTPUTS 256BGA
|
pacchetto: - |
Azione7.536 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC SLIC 1CH UNIV 85V 28PLCC
|
pacchetto: - |
Azione7.008 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.664 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Infineon Technologies |
IPAC-X ISDN PC ADAPTER CIRCUIT
|
pacchetto: - |
Request a Quote |
|
IOM-2 | 1 | 3.135V ~ 3.465V | - | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | PG-TQFP-64-1 |
||
Agere Systems |
MULTICHANNEL LAPD CONTROLLER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
XDSL CPE LINE DRIVER
|
pacchetto: - |
Azione13.890 |
|
- | 1 | 12.6V ~ 15.4V | 26.1mA | 1.37 W | -40°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Microchip Technology |
S/UNI-8x155 SATURN User Network
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
STRATAXGS MULTI-LAYER SWITCH W
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 10.8V ~ 13.2V | - | 580 mW | 0°C ~ 75°C | Through Hole | 24-CDIP (0.600", 15.24mm) | 24-CERDIP |
||
Harris Corporation |
EIA/ITU 24V PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -20V ~ -28V, 4.75V ~ 5.25V | - | 60 mW | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Texas Instruments |
SUPPORT CIRCUIT, CMOS, PBGA352
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |