Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC DSL FRONT-END 2.2V 324-LBGA
|
pacchetto: 324-LBGA |
Azione4.944 |
|
HDLC, Serial, TDM | 2 | - | - | 500mW | -40°C ~ 85°C | Surface Mount | 324-LBGA | PG-LBGA-324-2 |
||
Microsemi Corporation |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.328 |
|
- | 1 | 4.75 V ~ 5.25 V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
IC SLIC 2CH RINGING MTRG 44TQFP
|
pacchetto: 44-TQFP |
Azione4.144 |
|
2-Wire | 1 | - | - | - | - | Surface Mount | 44-TQFP | 44-TQFP |
||
Maxim Integrated |
IC TXRX T1/E1/J1 SGL-CHIP CSBGA
|
pacchetto: 100-LFBGA, CSPBGA |
Azione5.616 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Maxim Integrated |
IC MUX T3/E3 3.3V 256BGA
|
pacchetto: 256-BGA |
Azione5.296 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Intersil |
IC SLIC RINGING 3.3V VOB 32-QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione3.792 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Microchip Technology |
IC MCU-CONTROLLED PH CIRC 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione3.168 |
|
- | 1 | 3.1 V ~ 3.6 V | - | 520W | -25°C ~ 75°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
Texas Instruments |
IC RING GENERATOR CNTRLR 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione4.208 |
|
- | 1 | 12V | 1mA | - | -55°C ~ 125°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 52TQFP
|
pacchetto: 52-LQFP |
Azione6.384 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS PCM DTMF 56QFN
|
pacchetto: - |
Azione6.128 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DC-DC CTLR 47LGA
|
pacchetto: 60-WFQFN Exposed Pad |
Azione7.920 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | 0°C ~ 70°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 145V 48QFN
|
pacchetto: - |
Azione19.848 |
|
Parallel | 2 | 3.3V | 40mA | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC ITU CO/PABX LP 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.336 |
|
- | 1 | 4.75 V ~ 5.25 V | - | 1.5W | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.048 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
WIDEBAND FXS WITH ISI INTERFACE
|
pacchetto: 38-QFN |
Azione2.672 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 38-QFN | 38-QFN (4x6) |
||
Microchip Technology |
IC REDRIVER PCIE 3.0 32QFN
|
pacchetto: 32-TFQFN Exposed Pad |
Azione8.928 |
|
- | 2 | 2.5V | - | - | - | Surface Mount | 32-TFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC TXRX SGL T1/E1/J1 3.3V 80LQFP
|
pacchetto: 80-LQFP |
Azione6.944 |
|
- | 1 | 3V ~ 3.6V | 85mA | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-LQFP (14x14) |
||
Microchip Technology |
IC TRACKING BATT 90V 2CH 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione7.712 |
|
PCM | 1 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microchip Technology |
2CH 150V MISLIC PCM, 53QFN, T&R
|
pacchetto: - |
Azione2.512 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.744 |
|
- | 1 | 2.7V ~ 3.6V | 2mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Lantiq |
DECT HANDSET CONTROLLER WITH HAN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
TELECOM IC, CMOS, PBGA81
|
pacchetto: - |
Request a Quote |
|
E1, HDLC, J1, T1 | 1 | 1.8V, 3.3V | 80mA | - | -40°C ~ 85°C | Surface Mount | 80-QFP | P-MQFP-80-1 |
||
Lantiq |
GEMINAX D16 XXS 16 CHANNEL ADSL2
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
128G ENTERPRISE ETHERNET SWITCH
|
pacchetto: - |
Azione378 |
|
Ethernet | 57 | - | - | - | - | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
||
Broadcom Limited |
TRANSCEIVER MODULE ETHERNET
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
BCM56624B2IFSBLG
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC CONTROLLER D-CH EXCH 44-PLCC
|
pacchetto: - |
Request a Quote |
|
PCM | - | 4.75V ~ 5.25V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | P-LCC-44 |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
Serial | 4 | - | - | - | - | - | - | - |