Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC S-BUS INTERFACE EXT TQFP48
|
pacchetto: 48-LQFP |
Azione4.224 |
|
IOM-2, ISDN, SCI | 1 | 3.3V | 30mA | - | 0°C ~ 70°C | Surface Mount | 48-LQFP | P-TQFP-48 |
||
Infineon Technologies |
IC CONTROLR 32-CH HDLC 160-MQFP
|
pacchetto: 160-BQFP |
Azione2.160 |
|
HDLC, V.110, X.30 | - | 5V | 100mA | - | 0°C ~ 70°C | Surface Mount | 160-BQFP | P-MQFP-160 |
||
Silicon Labs |
IC SLIC/CODEC 2CHANNEL 64TQFP
|
pacchetto: 64-TQFP |
Azione3.728 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Silicon Labs |
IC LINEFEED INTRFC 125V 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Azione6.752 |
|
GCI, PCM, SPI | 2 | 3.13 V ~ 5.25 V | 65mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC TXRX DS3/E3 100CSBGA
|
pacchetto: 100-LBGA, CSBGA |
Azione4.736 |
|
DS3, E3 | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA, CSBGA | 100-CSBGA (11x11) |
||
Cirrus Logic Inc. |
IC LIU OCTAL T1/E1/J1 144LQFP
|
pacchetto: 144-LQFP |
Azione3.312 |
|
E1, J1, T1 | 8 | 3.14 V ~ 3.47 V | - | 1.73W | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-LQFP (15x15) |
||
Cirrus Logic Inc. |
IC LIU OCTAL E1 144LQFP
|
pacchetto: 144-LQFP |
Azione4.944 |
|
E1 | 8 | 3.135 V ~ 3.465 V | - | 1.04W | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-LQFP (20x20) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione7.232 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 21+1CH SHORT 640BGA
|
pacchetto: 640-BGA Exposed Pad |
Azione3.552 |
|
LIU | - | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-PBGA-EP (31x31) |
||
Microsemi Corporation |
IC VCP II NGCC 72CH 144LBGA
|
pacchetto: - |
Azione7.264 |
|
2-Wire | 1 | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 1CH 44-TQFP
|
pacchetto: 44-LQFP |
Azione2.144 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP |
||
Microsemi Corporation |
IC SUBSCRIBER NETWRK DSIC 28PLCC
|
pacchetto: - |
Azione17.088 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Silicon Labs |
IC SLIC/CODEC PROG 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione4.128 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Silicon Labs |
IC PROSLIC FXS DTMF -106V 36QFN
|
pacchetto: - |
Azione5.760 |
|
3-Wire | 1 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.040 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC DUAL FXS ANLG 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.392 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Silicon Labs |
IC PROSLIC SGL FXS ANLG 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.712 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Solutions Sdn Bhd. |
QUAD PORT GIGABIT QSGMII COPPER
|
pacchetto: - |
Azione6.864 |
|
- | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 138-QFN (12x12) |
||
Microchip Technology |
IC SWITCH ETHERNET 672BGA
|
pacchetto: - |
Azione5.952 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
Microchip Technology |
IC RECEIVER
|
pacchetto: - |
Azione5.440 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256LQFP
|
pacchetto: 256-LQFP |
Azione7.376 |
|
- | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.456 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.072 |
|
PCM, SPI | 1 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
onsemi |
TELECOM CIRCUIT, 1-FUNC, PBGA8
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
EPON/GPON FE PROCESSOR
|
pacchetto: - |
Request a Quote |
|
PHY, USB | - | - | - | - | - | - | - | - |
||
Harris Corporation |
SUBSCRIBER LINE INTERFACE CIRCUI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
MUSLIC MULTICHANNEL SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
DUAL CORE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |