Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SLIC VOICE ACCESS VQFN-48
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.112 |
|
IOM-2, PCM | 2 | 5V | 105mA | - | - | Surface Mount | 48-VFQFN Exposed Pad | P-VQFN-48-4 |
||
Microsemi Corporation |
IC ECHO CANCEL DUAL CODEC 81CBGA
|
pacchetto: 81-LBGA |
Azione6.048 |
|
Serial | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 81-LBGA | 81-CABGA (10x10) |
||
Microsemi Corporation |
IC VCP II NGCC 72CH 144LBGA
|
pacchetto: - |
Azione31.464 |
|
- | 1 | - | - | - | - | Surface Mount | - | 144-BGA |
||
Microsemi Corporation |
IC DGTL SWITCH IDX 64X64 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione3.344 |
|
- | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
Texas Instruments |
IC TXRX INTERFACE DEVICE 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione17.196 |
|
ISDN | - | 4.75 V ~ 5.25 V | - | - | - | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 16CH 316STBGA
|
pacchetto: 316-BGA |
Azione7.408 |
|
LIU | 16 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 316-BGA | 316-STBGA (21x21) |
||
Texas Instruments |
IC TONE DECODER CMOS 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione92.004 |
|
- | 1 | 2 V ~ 9 V | - | 500mW | -25°C ~ 100°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
IC SPEAKERPHONE VOICE SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.048 |
|
- | 1 | 5.4V | 9mA | 100mW | -20°C ~ 60°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC DAA W/FULL-WAVE RING 32-SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione2.240 |
|
- | 1 | 3 V ~ 5.5 V | 10mA | 1W | 0°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Rohm Semiconductor |
IC MELODY LSI FOR PHONE SSOP-B16
|
pacchetto: 16-LSSOP (0.173", 4.40mm Width) |
Azione25.188 |
|
- | 1 | 2.7 V ~ 3.6 V | - | 450mW | -20°C ~ 70°C | Surface Mount | 16-LSSOP (0.173", 4.40mm Width) | 16-SSOPB |
||
Silicon Labs |
IC SLIC LINE SUBSCRIBER 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione15.276 |
|
- | 1 | 3.13 V ~ 3.47 V | 25mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.432 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 68QFN
|
pacchetto: - |
Azione10.032 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microsemi Corporation |
ARROW 2XGE PB FREE
|
pacchetto: 896-BGA |
Azione4.832 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
||
Microchip Technology |
10 PORT CE SWITCH W/8 GIGE CU PH
|
pacchetto: - |
Azione3.664 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DUAL PORT ETHERNET 256BGA
|
pacchetto: - |
Azione6.756 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
TQFP48, GREEN, IND, MRLB, NO FLA
|
pacchetto: 48-TQFP |
Azione9.180 |
|
SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
pacchetto: 324-BGA |
Azione7.280 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
pacchetto: - |
Azione5.792 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32 LINK, 256 HDLC CHANNEL FRAME
|
pacchetto: - |
Azione3.904 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC LINE DRIVER CLASS AB 28QFN
|
pacchetto: - |
Azione5.472 |
|
- | 2 | - | - | - | - | Surface Mount | - | 28-QFN |
||
Broadcom Limited |
1156 FCBGAHS-G 35X35
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH END EPON/GPON HGU COMMERCIA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | 0°C ~ 70°C | - | - | - |
||
Lantiq |
GEMINAX-A8+ MAX 8 CHANNEL ADSL2+
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
BCM63137RUXX1
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
TSLIC-S TWIN SUBSCRIBER LINE INT
|
pacchetto: - |
Request a Quote |
|
IOM-2, PCM | 2 | 3.3V ~ 5V | 105mA | - | -40°C ~ 85°C | Surface Mount | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | P-DSO-36-10 |
||
Infineon Technologies |
IPAC-X ISDN PC ADAPTER CIRCUIT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
QUAD SFI-XFIB/RICARD
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |