Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LIU E1/T1/J1 160BGA
|
pacchetto: 160-LBGA |
Azione6.192 |
|
E1, HDLC, J1, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 160-LBGA | PG-LBGA-160 |
||
Infineon Technologies |
IC MTSI SWITCHING MQFP100
|
pacchetto: 100-BQFP |
Azione2.928 |
|
PCM, PLL | 1 | 3.13 V ~ 3.47 V | 200mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | P-MQFP-100 |
||
Infineon Technologies |
IC SIDEC T/E 32CHAN TQFP-144-8
|
pacchetto: 144-LQFP |
Azione3.392 |
|
PCM, Serial, UCC | 4 | 3 V ~ 3.6 V | 350mA | 900mW | 0°C ~ 70°C | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Exar Corporation |
IC LIU E1 7CH 3.3V 100TQFP
|
pacchetto: 100-LQFP |
Azione15.312 |
|
LIU | 7 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 75°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 85V 28PLCC
|
pacchetto: - |
Azione15.132 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Silicon Labs |
IC PROSLIC LINE FEED 135V 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione3.136 |
|
PCM | 2 | - | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
pacchetto: 100-LQFP |
Azione5.520 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Maxim Integrated |
IC OCTAL FRAMER T1/E1/J1 256-BGA
|
pacchetto: 256-LBGA, CSBGA |
Azione12.396 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
STMicroelectronics |
IC SLIC 44TQFP
|
pacchetto: 44-LQFP |
Azione27.708 |
|
- | 1 | 4.75 V ~ 5.25 V | 5.5mA | 1.1W | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP |
||
Rohm Semiconductor |
IC SPEECH NETWORK DIP18
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione11.136 |
|
- | 1 | 1.15 V ~ 1.27 V | - | 1.1W | -35°C ~ 60°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-DIP |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.656 |
|
E1 | 1 | 4.75 V ~ 5.25 V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 16CH SH 484BGA
|
pacchetto: 484-LFBGA |
Azione3.440 |
|
E1, J1, T1 | 16 | 1.8V, 3.3V | - | 3.10W | -40°C ~ 85°C | Surface Mount | 484-LFBGA | 484-CABGA (19x19) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 512X256 44MQFP
|
pacchetto: 44-QFP |
Azione6.576 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -106V 48QFN
|
pacchetto: - |
Azione5.904 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC TXRX DTMF 3V 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione6.320 |
|
- | 1 | 2.7 V ~ 3.6 V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione31.200 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Microsemi Corporation |
ARROW 2488, PB FREE
|
pacchetto: - |
Azione4.160 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
12X1G + 2X10G (SERVAL-2) CE SWIT
|
pacchetto: - |
Azione4.944 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC XDSL LINE DVR DUAL-PORT 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.856 |
|
Serial | 2 | 10 V ~ 14.7 V | 19.5mA | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TDM SWITCH 512CH 160LQFP
|
pacchetto: 160-LQFP |
Azione2.752 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 160-LQFP | 160-LQFP (24x24) |
||
Microchip Technology |
IC TDM SWITCH 512CH 160LQFP
|
pacchetto: 160-LQFP |
Azione2.544 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 160-LQFP | 160-LQFP (24x24) |
||
Infineon Technologies |
PBL38621/2 - FLEXISLIC, SUBSCRIB
|
pacchetto: - |
Request a Quote |
|
2-Wire | 1 | 4.75V ~ 5.25V | 4mA | 1.5 W | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
28GE + 4X10GE + 2XHG21
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Agere Systems |
T7230 - PRIMARY ACCESS FRAMER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
IP PHONE CHIP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
212, BONDED 106, V/ADSL, 10G GW
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |