Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR TQFP-64
|
pacchetto: 64-LQFP |
Azione2.688 |
|
ISDN | 1 | 3.3V | 30mA | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | P-TQFP-64 |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 46DB 44TQFP
|
pacchetto: 44-TQFP Exposed Pad |
Azione6.576 |
|
2-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-eTQFP (10x10) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione18.000 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC LINE FEED 100V 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione4.704 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
STMicroelectronics |
IC RINGER ELECTR 2TONE 8-MINIDIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.656 |
|
- | 1 | 26V | 30mA | - | -40°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-Mini DIP |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione4.736 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Maxim Integrated |
IC FRAMER E1 QUAD 5V 128-TQFP
|
pacchetto: 128-LQFP |
Azione4.144 |
|
Parallel/Serial | 4 | 4.5 V ~ 5.5 V | 32mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Maxim Integrated |
IC LIU T3/E3/STS-1 IND 48LQFP
|
pacchetto: 48-LQFP |
Azione4.896 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-TQFP (7x7) |
||
Maxim Integrated |
IC TXRX QUAD E1 3.3V 256-BGA
|
pacchetto: 256-BGA |
Azione4.448 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione3.504 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Microsemi Corporation |
IC SLAC NG EXT RING 196BGA
|
pacchetto: - |
Azione2.656 |
|
- | 1 | - | - | - | - | Surface Mount | - | 196-BGA |
||
Microsemi Corporation |
IC RECEIVER DTMF 50DB 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.728 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IXYS Integrated Circuits Division |
IC PHONE LINE MONITOR 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.856 |
|
- | 1 | 3 V ~ 5.5 V | 10mA | 300mW | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microsemi Solutions Sdn Bhd. |
QUAD 10/100/1000BASE-T & 100BASE
|
pacchetto: - |
Azione5.664 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microsemi Corporation |
32 LINK, 256 HDLC CHANNEL FRAME
|
pacchetto: - |
Azione3.280 |
|
- | - | - | - | - | - | - | - | - |
||
ams |
INTERFACE TELECOM
|
pacchetto: Die |
Azione5.456 |
|
Serial | 1 | - | 3mA | - | -25°C ~ 70°C | Surface Mount | Die | Die |
||
Broadcom Limited |
24GE SWITCH
|
pacchetto: - |
Azione2.496 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TXRX DTMF 3V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.688 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
pacchetto: 208-LBGA |
Azione2.272 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DSIC 28PLCC
|
pacchetto: - |
Azione5.216 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
1CH 150V MISLIC, 36QFN
|
pacchetto: 36-QFN |
Azione3.312 |
|
PCM, SPI | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 36-QFN | 36-QFN (6x4) |
||
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MILLI A
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
CML Microcircuits |
IC TELECOM INTERFACE 48LQFP
|
pacchetto: - |
Request a Quote |
|
C-Bus | 1 | 3V ~ 3.6V | 17.5mA | 1.6 W | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IXYS Integrated Circuits Division |
IC TELECOM INTERFACE 16SOIC
|
pacchetto: - |
Request a Quote |
|
Logic | 1 | 4.5V ~ 5.5V | 2mA | 10 mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Harris Corporation |
SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -20V ~ -28V, 4.75V ~ 5.25V | - | 60 mW | -40°C ~ 85°C | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CERDIP |
||
Renesas Electronics Corporation |
SLIC LINE INTERFACE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH 1588 DISABLED
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRANSCEIVER MODULE ETHERNET
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |