Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SOC SHDSL SGL-CH 324-LBGA
|
pacchetto: 324-LBGA |
Azione2.624 |
|
HDLC, Parallel, Serial | 1 | 1.5V, 3.3V | - | 650mW | -40°C ~ 85°C | Surface Mount | 324-LBGA | PG-LBGA-324-2 |
||
Infineon Technologies |
IC SLIC VOICE ACCESS PDSO-20
|
pacchetto: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Azione4.032 |
|
IOM-2, PCM | 2 | 5V | 105mA | - | - | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
||
Infineon Technologies |
IC SICOFI-4 SGL CHIP CMOS MQFP64
|
pacchetto: 64-QFP |
Azione27.492 |
|
PCM, SPI | 4 | 5V | 26mA | 130mW | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Infineon Technologies |
IC LINE INTERFACE SLIC PDSO-24
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione5.808 |
|
- | 1 | 5V | 2.8mA | 730mW | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | PG-DSO-24 |
||
Infineon Technologies |
IC LINE INTERFACE SLIC PDSO24-8
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione5.712 |
|
- | 1 | 5V | 2.8mA | 290mW | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | PG-DSO-24 |
||
Microsemi Corporation |
IC VOICE ECHO CANCEL 535MCMBGA
|
pacchetto: 535-BGA |
Azione5.808 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Maxim Integrated |
IC FRAMER TRPL DS3/E3 144TCBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione7.872 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-CSPBGA (13x13) |
||
Silicon Labs |
IC SLIC/CODEC PROG QUAD 100TQFP
|
pacchetto: 100-TQFP Exposed Pad |
Azione4.192 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | - | Surface Mount | 100-TQFP Exposed Pad | 100-TQFP (14x14) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 176TQFP
|
pacchetto: 176-LQFP |
Azione5.280 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Silicon Labs |
IC PROSLIC/CODEC DUAL 64TQFP
|
pacchetto: 64-TQFP |
Azione7.120 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 16CH SH 484BGA
|
pacchetto: 484-LFBGA |
Azione6.800 |
|
E1, J1, T1 | 16 | 1.8V, 3.3V | - | 2.89W | -40°C ~ 85°C | Surface Mount | 484-LFBGA | 484-CABGA (19x19) |
||
Exar Corporation |
IC LIU/FRAMER 8CHAN 256BGA
|
pacchetto: - |
Azione3.680 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.944 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC SLICS ACCESS RING 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.856 |
|
- | 1 | 12.5V | 1.67mA | 25mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione6.976 |
|
HDLC, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Broadcom Limited |
ETHERNET SWITCH 10GE
|
pacchetto: - |
Azione7.856 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
pacchetto: 80-QFP |
Azione6.156 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 80-QFP | 80-MQFP (14x14) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione19.536 |
|
- | - | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
||
Microchip Technology |
QFN48, GREEN, IND, MRLB, NO FLAS
|
pacchetto: 48-VFQFN Exposed Pad |
Azione23.736 |
|
SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 64TQFP
|
pacchetto: - |
Azione3.232 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 64TQFP
|
pacchetto: - |
Azione7.056 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 64-eTQFP |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 100LQFP
|
pacchetto: 100-LQFP |
Azione3.824 |
|
LIU | 1 | 1.6V ~ 2V | 40mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microchip Technology |
IC SLIC 2CH RINGING MTRG 44TQFP
|
pacchetto: 44-TQFP |
Azione4.384 |
|
2-Wire | 1 | - | - | - | - | Surface Mount | 44-TQFP | 44-TQFP |
||
Microchip Technology |
IC SLIC 2CH 50DB 44TQFP
|
pacchetto: 44-TQFP Exposed Pad |
Azione4.672 |
|
- | 2 | 4.75V ~ 5.25V | 9mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
Microchip Technology |
IC DIGITAL SWITCH 32K CH 324BGA
|
pacchetto: 324-BGA |
Azione9.828 |
|
- | 1 | 1.71V ~ 1.89V | 500mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (19x19) |
||
Broadcom Limited |
INTEGRATED GBE MOBILE MAC/PHY
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
ADSL, DSL | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH
|
pacchetto: - |
Request a Quote |
|
PCI Express | - | - | - | - | - | - | - | - |