Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLAC CODEC/FILTER 8CH 121BGA
|
pacchetto: 121-LFBGA |
Azione30.780 |
|
PCI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 121-LFBGA | 121-LFBGA (10x10) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 512X256 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione4.640 |
|
- | 1 | 3 V ~ 3.6 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microsemi Corporation |
IC SLIC 1CH SWREG 63DB 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione3.632 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione2.672 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Exar Corporation |
IC LIU E1 QAUD 100TQFP
|
pacchetto: 100-LQFP |
Azione2.992 |
|
LIU | 4 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Maxim Integrated |
IC MUX T3/E3 3.3V 256BGA
|
pacchetto: 256-BGA |
Azione3.872 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 8CH SHORT HAUL 144TQFP
|
pacchetto: 144-LQFP |
Azione5.968 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Intersil |
IC SLIC RINGING 3.3V VOB 32-QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione2.176 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Silicon Labs |
IC SLIC PROG DUAL-CH 64TQFP
|
pacchetto: 64-TQFP |
Azione5.376 |
|
ISDN | 2 | 3.13 V ~ 3.47 V | 28mA | 280mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Maxim Integrated |
IC TRANSCEIVER T1 IND 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.096 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Maxim Integrated |
IC LIU DS3/E3/STS1 QUAD 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione5.104 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 300mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 8CH 225BGA
|
pacchetto: 225-BGA |
Azione18.000 |
|
- | 8 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 48QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione3.280 |
|
4-Wire | 1 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microsemi Corporation |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione20.388 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Corporation |
155 MBIT/S ATM AND PACKET-OVER-S
|
pacchetto: - |
Azione5.568 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DNIC 24SSOP
|
pacchetto: - |
Azione3.104 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |
||
Microchip Technology |
IC VOICE PROCESSOR VCP 128TQFP
|
pacchetto: 128-TQFP |
Azione7.216 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microchip Technology |
1CH G.HN LINE DRIVER
|
pacchetto: 16-QFN |
Azione22.104 |
|
- | 1 | - | - | - | - | Surface Mount | 16-QFN | 16-QFN (4x4) |
||
Broadcom Limited |
VDSL 17A + 11AC WIFI 1GE + 4FE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
ITU LOW COST, PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 9.5mA | 1.5 W | 0°C ~ 70°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Gennum |
GENNUM TELECOM CIRCUIT 1-FUNC
|
pacchetto: - |
Request a Quote |
|
- | - | 3.3V | 480mA | - | 0°C ~ 70°C | Surface Mount | 128-QFP | 128-QFP |
||
Broadcom Limited |
FAST ETHERNET IP PHONE CHIP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
BIPOLAR SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, PCM INTERFACE
|
pacchetto: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | -40°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Broadcom Limited |
BCM63167VSH00
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |