Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IXYS Integrated Circuits Division |
IC TELECOM SWITCH 170MA 8-SMD
|
pacchetto: 8-SMD, Gull Wing |
Azione6.272 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 256BGA
|
pacchetto: 256-BGA |
Azione3.472 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC DGTL TELEPHONE CIRCUIT 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.336 |
|
- | 1 | 4.75 V ~ 5.25 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Microsemi Corporation |
IC VOICE LINE VCP 32CH 144LBGA
|
pacchetto: - |
Azione15.444 |
|
2-Wire | 32 | 3.3V | - | - | - | Surface Mount | - | 144-LBGA |
||
IXYS Integrated Circuits Division |
IC TRANSCEIVER MFC 2CHAN 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.080 |
|
- | 1 | 4.75 V ~ 5.25 V | 75mA | 1W | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Maxim Integrated |
IC TESTER BIT ERROR RATE 32-TQFP
|
pacchetto: 32-TQFP |
Azione3.856 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Exar Corporation |
8 CH LH/SH T1/E1 LIU + FRAMER (8
|
pacchetto: - |
Azione5.008 |
|
E1, J1, T1 | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
NXP |
IC C2K 1.2GHZ 8CH VOIP 625BGA
|
pacchetto: - |
Azione2.832 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione5.472 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 150V 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.832 |
|
4-Wire | 2 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.696 |
|
Serial | 1 | - | 3mA | - | -15°C ~ 60°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC SWITCH ETHERNET 672BGA
|
pacchetto: - |
Azione6.688 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
Microchip Technology |
MODULE SONET/SDH
|
pacchetto: - |
Azione7.600 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24GE + 4X2.5G 10GE SWITCH
|
pacchetto: - |
Azione7.248 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 4KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione7.440 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DSIC 24SSOP
|
pacchetto: - |
Azione5.808 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |
||
Microchip Technology |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.048 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC PROSLIC FXS 40QFN
|
pacchetto: - |
Azione2.560 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
pacchetto: 80-QFP |
Azione3.664 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 80-QFP | 80-MQFP (14x14) |
||
Microchip Technology |
10PRT UNMAN L2 SW W/8 INT CU PHY
|
pacchetto: 672-BGA |
Azione7.500 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Broadcom Limited |
MULTI LAYER SWITCH 10G
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Fairchild Semiconductor |
TONE DECODER CIRCUIT PDIP8
|
pacchetto: - |
Request a Quote |
|
4-Wire | 1 | 4V ~ 6V | 7.5mA | - | 0°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Request a Quote |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Microchip Technology |
HDLIU# 32
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
5 REN RINGING SLIC SUBSCRIBER LI
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 6mA | 300 mW | 0°C ~ 75°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
INCA-S CODEC
|
pacchetto: - |
Request a Quote |
|
IOM-2 | 1 | - | - | - | - | Surface Mount | 144-BQFP | P-MQFP-144-8 |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |