Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Exar Corporation |
IC LIU
|
pacchetto: - |
Azione2.816 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione13.044 |
|
T1 | 1 | 3 V ~ 3.6 V | 1.8mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1/OC3 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione13.464 |
|
- | 1 | 3 V ~ 3.6 V | 50mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microsemi Corporation |
IC SLAC CODEC/FILTER 8CH 121BGA
|
pacchetto: 121-LFBGA |
Azione76.632 |
|
PCI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 121-LFBGA | 121-LFBGA (10x10) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 60QFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione3.936 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | 0°C ~ 70°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione2.256 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 100-LBGA
|
pacchetto: 100-LBGA |
Azione4.800 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione18.876 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 44TQFP
|
pacchetto: 44-LQFP |
Azione4.176 |
|
LIU | 1 | 4.75 V ~ 5.25 V | 180mA | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
pacchetto: 144-LQFP |
Azione2.960 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Texas Instruments |
IC ADAPTER DIG QDASL QUAD 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.888 |
|
TDM | 4 | - | - | - | - | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 SGL SHORT HAUL 44-TQFP
|
pacchetto: 44-LQFP |
Azione4.272 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.928 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Intersil |
IC LINE DRIVER VDSL2 DIFF 16QFN
|
pacchetto: 16-TQFN Exposed Pad |
Azione4.480 |
|
- | 1 | ±4 V ~ 6.6 V, 8 V ~ 13.2 V | - | - | -40°C ~ 85°C | Surface Mount | 16-TQFN Exposed Pad | 16-QFN (4x4) |
||
Microsemi Solutions Sdn Bhd. |
DUAL 10/100/1000 BASE-T & 100/10
|
pacchetto: - |
Azione5.056 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
NXP |
CABLE FST DEMOD
|
pacchetto: - |
Azione4.496 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH 10G
|
pacchetto: - |
Azione4.240 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETHERNET SWITCH 24X 10GE I TEMP
|
pacchetto: - |
Azione5.776 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24FE + 2X2.5GE + 2X10G
|
pacchetto: - |
Azione6.368 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH DHS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione2.128 |
|
Parallel | 1 | 4.75V ~ 5.25V | 100mA | - | -40°C ~ 85°C | Surface Mount | 84-LCC (J-Lead) | 84-PLCC |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.576 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
pacchetto: 80-QFP |
Azione4.000 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 80-QFP | 80-MQFP (14x14) |
||
Silicon Labs |
IC PROSLIC FXS
|
pacchetto: - |
Azione3.840 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE BITS TRANSCEIVER AND CC R
|
pacchetto: - |
Azione810 |
|
E1 | 1 | 1.62V ~ 1.98V | 152mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Infineon Technologies |
ISAC-S ISDN ACCESS CONTROLLER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
GPON SOC PB-FREE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MA LOOP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
CABGA 17.00X17.00X1.40 MM, 1.00M
|
pacchetto: - |
Request a Quote |
|
E1, J1, Parallel, SPI, T1 | 8 | 1.68V ~ 1.98V, 3V ~ 3.6V | - | 800 mW | -40°C ~ 85°C | Surface Mount | 256-LBGA | 256-CABGA (17x17) |