Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP 100-TQFP
|
pacchetto: 100-LQFP |
Azione5.152 |
|
Parallel, PCM, Serial | 1 | - | - | - | - | Surface Mount | 100-LQFP | PG-TQFP-100 |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 44MQFP
|
pacchetto: 44-QFP |
Azione2.640 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione85.128 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC VOIP IP PHONE ASSP 128QFP
|
pacchetto: 128-BFQFP |
Azione4.720 |
|
LCD | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 128-BFQFP | 128-PQFP (14x20) |
||
Silicon Labs |
IC PROSLIC LINE FEED 150V 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.256 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | - | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC MICRODAA PCM HWY 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.376 |
|
PCM, SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN Exposed Pad (5x5) |
||
STMicroelectronics |
IC RINGER ELECTR 2TONE 8-MINIDIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione769.380 |
|
- | 1 | 26V | 30mA | - | -40°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-Mini DIP |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100-LQFP
|
pacchetto: 100-LQFP |
Azione4.416 |
|
E1, J1, T1, TDM, UTOPIA II | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione4.784 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.128 |
|
- | 2 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RECEIVER DTMF CMOS LP 18-DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione94.200 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | 35mW | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-DIP |
||
NXP |
IC C2K 900MHZ 8CH VOIP 625FCBGA
|
pacchetto: - |
Azione2.976 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 512X256 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.784 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Silicon Labs |
IC PROSLIC FXS 1CH -136V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione6.144 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 SGL 100-LQFP
|
pacchetto: 100-LQFP |
Azione5.952 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC PHONE LINE INTERFACE 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione13.560 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Renesas Electronics America |
IC SLIC UNIVERSAL LP 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.016 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 2W | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC SLIC 1CH 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.512 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
pacchetto: 324-BGA |
Azione5.200 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TXRX DTMF 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.344 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 10.8V ~ 13.2V | - | 580 mW | 0°C ~ 75°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Lantiq |
MUNICH256 MULTI CHANNEL NETWORK
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Zarlink |
MT9080 - TELECOM IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI-10G/40G OTN FRAMER/MAPPER/
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
EPON/GPON HGU
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
TELECOMS IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRAFFIC MGR PACKETPROC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |