Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLIC 1CH UNIV 10V 28PLCC
|
pacchetto: - |
Azione425.040 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione1.082.892 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
IC SLAC 1CH 70V MTRG 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione18.228 |
|
2-Wire | - | 3.3V | - | - | - | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microsemi Corporation |
IC SLIC 1CH SWREG 63DB 44TQFP
|
pacchetto: 44-TQFP |
Azione5.904 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione3.088 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 484-BGA
|
pacchetto: 484-BGA |
Azione5.664 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione5.520 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Maxim Integrated |
IC TXRX E1 QUAD 100-LQFP
|
pacchetto: 100-LQFP |
Azione5.696 |
|
E1 | 4 | 3.14 V ~ 3.47 V | 230mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Exar Corporation |
IC LIU/FRAMER 8CHAN 329BGA
|
pacchetto: - |
Azione5.008 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC SLAC NGCC 8CH 176LQFP
|
pacchetto: - |
Azione404.664 |
|
2-Wire | 1 | - | - | - | - | Surface Mount | - | 176-LQFP |
||
Microsemi Corporation |
IC SLIC 2CH NGCCC 48QFN 7X7
|
pacchetto: 48-QFN |
Azione14.364 |
|
2-Wire | - | - | - | - | - | Surface Mount | 48-QFN | 48-QFN |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 60QFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione7.744 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.704 |
|
- | 2 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC FXO CODEC 1CH 3V 44QFN
|
pacchetto: 44-QFN |
Azione360.000 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-QFN | 44-QFN (7x7) |
||
NXP |
CABLE FST DEMOD
|
pacchetto: - |
Azione6.960 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CODEC ICO-2CMOS 18DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione4.992 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.024 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC TRANSCODER ADPCM LP 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.616 |
|
- | 4 | 3V ~ 3.6V | 100µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Texas Instruments |
INTERFACE TELECOM
|
pacchetto: Die |
Azione3.792 |
|
- | 1 | 10V ~ 28V | 23mA | - | -25°C ~ 85°C | Surface Mount | Die | Wafer |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR, P
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 690 mW | 0°C ~ 75°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MILLI A
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETH SWITCH 24GE 4X10GE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
CML Microcircuits |
IC TELECOM INTERFACE 20TSSOP
|
pacchetto: - |
Azione222 |
|
Parallel | 1 | 2.7V ~ 5.5V | 1.5mA | 300 mW | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Broadcom Limited |
63168V+6302+53124S+
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
PMB7728 DECT IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
PCI-E GBE MAC/PHY PLUS TPM1.2 /
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SUBSCRIBER L
|
pacchetto: - |
Request a Quote |
|
IOM-2, PCM | 2 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20-5 |