Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC LIU E1 8CH SHORT HAUL 160-BGA
|
pacchetto: 160-BGA |
Azione5.712 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 160-BGA | 160-PBGA (15x15) |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
pacchetto: 64-TQFP |
Azione26.172 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Maxim Integrated |
IC TXRX 1-CHIP T1 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione5.616 |
|
HDLC, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.696 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC DGTL SWITCH F16KDX 272BGA
|
pacchetto: 272-BGA |
Azione5.472 |
|
- | 1 | 3 V ~ 3.6 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 28+1CH 640BGA
|
pacchetto: 640-BGA Exposed Pad |
Azione3.456 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-PBGA-EP (31x31) |
||
Microsemi Corporation |
IC CESOP PROCESSOR 64CH 324BGA
|
pacchetto: 324-BGA |
Azione6.096 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Silicon Labs |
IC PROSLIC DUAL FXS ANLG 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.128 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
IC TRACKING BATT 90V 2CH 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione21.708 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Texas Instruments |
IC VDSL2 LINE DVR AMP 24VQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.312 |
|
- | 2 | 10 V ~ 28 V | - | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN (5x4) |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Azione3.168 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
ARROW 24XFE PB FREE
|
pacchetto: - |
Azione5.856 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione4.768 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione6.256 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 272BGA
|
pacchetto: 272-BBGA |
Azione7.872 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microchip Technology |
8 CHANNEL FAST ETHERNET OVER SON
|
pacchetto: - |
Azione3.104 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24FE + 2X2.5GE + 2X10G
|
pacchetto: - |
Azione2.880 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICE ECHO CANCEL 4CH 100LQFP
|
pacchetto: 100-LQFP |
Azione5.952 |
|
- | 1 | 1.6V ~ 2V | 5mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microchip Technology |
IC TDM/TSI SWITCH 512X256 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.032 |
|
- | 1 | 3V ~ 3.6V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DSIC 28PLCC
|
pacchetto: - |
Azione3.536 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
IC VOICEPORT 1CH FXS 4KHZ 44LQFP
|
pacchetto: 44-LQFP |
Azione2.208 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.536 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC DGTL SWITCH IDX 64X64 64MQFP
|
pacchetto: 64-BQFP |
Azione10.176 |
|
- | 1 | 4.5V ~ 5.5V | 10mA | - | -40°C ~ 85°C | Surface Mount | 64-BQFP | 64-MQFP (10x10) |
||
Microchip Technology |
PM8620 - 20G Narrowband Switch E
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
RINGING SLIC FOR ISDN MODEM
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 6mA | 300 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Infineon Technologies |
ABM 3G ATM BUFFER MANAGER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
4X1G+4X1G SWITCH, I-TEMP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
4 CHANNEL ISDN ANALOG FRONT END
|
pacchetto: - |
Request a Quote |
|
IOM-2 | 4 | 4.75V ~ 5.25V | 2mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-MQFP-64-9 HS |