Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 40LFCSP
|
pacchetto: 40-VFQFN Exposed Pad, CSP |
Azione6.688 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad, CSP | 40-LFCSP (6x6) |
||
ON Semiconductor |
IC TEMP MONITOR 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.208 |
|
Logic | Logic | 2-Wire SMBus | 4mA | -40°C ~ 120°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Micro8? |
||
Texas Instruments |
IC 4-20 MA I-TRANSMITTER 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione4.144 |
|
Differential | Voltage | 3-Wire | 20mA | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Texas Instruments |
IC 4-20MA TRANSMITTER 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione30.192 |
|
Voltage | Voltage | 2-Wire | 20mA | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
Exar Corporation |
SENSOR
|
pacchetto: 24-WFQFN Exposed Pad |
Azione7.744 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
||
Maxim Integrated |
IC CONV THRMCPLE-DIG N TYPE TDFN
|
pacchetto: 10-WFDFN Exposed Pad |
Azione5.776 |
|
Thermocouple (Multiple) | Digital | 1-Wire? | 900µA | -40°C ~ 125°C | Surface Mount | 10-WFDFN Exposed Pad | 10-TDFN-EP (3x4) |
||
Linear Technology |
IC THERMOCOUPLE AMPLIFIER 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.000 |
|
Voltage | Thermocouple | - | 800µA | 0°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.360 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.192 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC ION SMOKE DETECT ASIC 16DIP
|
pacchetto: - |
Azione17.100 |
|
- | - | - | 30µA | -10°C ~ 60°C | - | - | - |
||
Analog Devices Inc. |
IC THERMCPL SGNL COND ISOL 38DIP
|
pacchetto: 38-DIP (0.800", 20.32mm), 12 Leads |
Azione5.264 |
|
Voltage | Voltage | - | 12mA | -40°C ~ 85°C | Through Hole | 38-DIP (0.800", 20.32mm), 12 Leads | - |
||
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 32-LFCSP
|
pacchetto: 32-WFQFN Exposed Pad, CSP |
Azione36.000 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad, CSP | 32-LFCSP-WQ (5x5) |
||
Maxim Integrated |
IC AUTO SNSR SIGNAL COND 16SSOP
|
pacchetto: 16-SSOP (0.209", 5.30mm Width) |
Azione6.540 |
|
Analog | Analog | - | 6mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
ams |
IC ULTRASONIC FLOW SENSOR 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione4.352 |
|
Digital | Digital | SPI, UART | 1.9µA | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Analog Devices Inc. |
IC PHOTOMETRIC FRONT END
|
pacchetto: - |
Request a Quote |
|
- | Digital, I2C | - | - | - | - | Module | Module |
||
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE ON 304 MICRO METER WAFER NO
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 15 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
CCD LINEAR IMAGE SENSOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 32-LFCSP
|
pacchetto: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad, CSP | 32-LFCSP-WQ (5x5) |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 10BIT 48-LQFP
|
pacchetto: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
24V 100MA PIN-CONFIGURABLE INDUS
|
pacchetto: - |
Request a Quote |
|
Logic | - | - | 1.2 mA | -40°C ~ 105°C (TA) | Surface Mount | 12-WFBGA, WLBGA | 12-WLP (2.14x1.56) |
||
Analog Devices Inc. |
OPTICAL AFE FOR WEARABLES-SPI
|
pacchetto: - |
Azione12.459 |
|
Digital | SPI | - | 10 µA | -40°C ~ 85°C | Surface Mount | 35-UFBGA, WLCSP | 35-WLCSP (3.11x2.14) |
||
Analog Devices Inc./Maxim Integrated |
IC INTEGRATED CIRCUIT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
TSSOP / 14 / 4,4MM G1 - TAPE&REE
|
pacchetto: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |