Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc. |
IC CCD SGNL PROC 14BIT 84CSBGA
|
pacchetto: 84-LFBGA, CSPBGA |
Azione6.704 |
|
- | - | 3-Wire Serial | - | -25°C ~ 85°C | Surface Mount | 84-LFBGA, CSPBGA | 84-CSPBGA (6x6) |
||
NXP |
IC SMOKE DETECT WITH I/O 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione38.796 |
|
Photoelectric | Voltage | - | 12µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC COMPARATOR DL TMP 3/5V FCHIP
|
pacchetto: 8-FlipChip |
Azione6.160 |
|
Analog | Digital | - | 225µA | -40°C ~ 125°C | Surface Mount | 8-FlipChip | 8-FlipChip |
||
Maxim Integrated |
IC SIGNAL COND QUAD 68-QFN
|
pacchetto: 68-VFQFN Exposed Pad |
Azione5.088 |
|
CML | CML | LVTTL | 495mA | 0°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN Exposed Pad (10x10) |
||
Exar Corporation |
SENSOR
|
pacchetto: 24-WFQFN Exposed Pad |
Azione6.592 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
||
Intersil |
IC TOF SIGNAL PROCESSOR 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.384 |
|
- | - | I2C | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x5) |
||
Melexis Technologies NV |
IC OPTICAL PROXIMITY 24QFN
|
pacchetto: - |
Azione7.856 |
|
- | - | - | 2.1mA | -40°C ~ 125°C | - | - | - |
||
Diodes Incorporated |
PIR CONTROLLER PDIP-16
|
pacchetto: - |
Azione5.072 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
||
Texas Instruments |
IC 8CH RELAY DRVR 20-HTSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione7.536 |
|
Logic | Logic | Serial | 5mA | -40°C ~ 125°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-HTSSOP |
||
Microchip Technology |
IC DRIVER HORN PIEZO W/BO 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.984 |
|
Voltage | Voltage | CMOS | 300µA | -10°C ~ 60°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.664 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC HORN DRIVER DUAL 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione18.360 |
|
Logic | Logic | Logic | 500µA | 0°C ~ 50°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Texas Instruments |
IC 4-20MA 2-WIRE TRNSMTR 24-QSOP
|
pacchetto: 24-SSOP (0.154", 3.90mm Width) |
Azione78.528 |
|
Voltage | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Surface Mount | 24-SSOP (0.154", 3.90mm Width) | 24-SSOP/QSOP |
||
Texas Instruments |
IC AMP ADAPTIV VAR SENSOR 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione13.380 |
|
Logic | Logic | - | 6mA | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Infineon Technologies |
IC SWITCH PROXIMITY INDCT 16DSO
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione23.442 |
|
Analog | Analog | - | 550µA | -40°C ~ 110°C | - | 16-SOIC (0.154", 3.90mm Width) | PG-DSO-16-1 |
||
ams |
IC CONVERTER TIME-FLIGHT 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione7.704 |
|
LVDS | LVDS | SPI | 2mA | -40°C ~ 125°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Maxim Integrated |
IC SENSOR SIGNAL COND 16-SSOP
|
pacchetto: 16-SSOP (0.209", 5.30mm Width) |
Azione12.696 |
|
Analog | Analog | Serial | 2.5mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
Texas Instruments |
IC 4-20MA CURRENT TRANS 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione17.832 |
|
Differential | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
ams |
IC CONVERTER TIME-FLIGHT 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione21.864 |
|
LVDS | LVDS | SPI | 2mA | -40°C ~ 125°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Linear Technology |
IC THERMOCOUPL COMP& KIT 8DIP
|
pacchetto: 8-CDIP (0.300", 7.62mm) |
Azione7.600 |
|
Voltage | Thermocouple | - | 800µA | 0°C ~ 70°C | Through Hole | 8-CDIP (0.300", 7.62mm) | 8-CERDIP |
||
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER UNSAWN, 304
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | I2C, Serial | - | 1.1 mA | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
STMicroelectronics |
FLEXINPUT IC FOR AUTOMOTIVE APPL
|
pacchetto: - |
Azione6.990 |
|
Analog, Digital | SPI | - | - | - | Surface Mount | 48-TQFP Exposed Pad | 48-TQFP-EP (7x7) |
||
Texas Instruments |
DIGITAL SENSOR OUTPUT DRIVER WIT
|
pacchetto: - |
Azione11.325 |
|
Logic | - | - | 2.95 mA | -40°C ~ 125°C (TA) | Surface Mount | 10-VFDFN Exposed Pad | 10-VSON (3x3) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
TSSOP / 14 / 4,4MM G1 - TUBE
|
pacchetto: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |