Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ams |
IC CURRENT MEASURE SOLAR 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.192 |
|
Analog, Digital | Analog, Digital | Serial | 5mA | -40°C ~ 125°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.296 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
NXP |
IC SMOKE DETECT PHOTOELEC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.048 |
|
Photoelectric | Voltage | - | 12µA | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 14BIT 48LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione5.360 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
||
Analog Devices Inc. |
IC PROCESSOR CCD 12BIT 105CSBGA
|
pacchetto: 105-LFBGA, CSPBGA |
Azione5.280 |
|
Logic | Logic | 3-Wire Serial | 20mA | -25°C ~ 85°C | Surface Mount | 105-LFBGA, CSPBGA | 105-CSPBGA (8x8) |
||
Analog Devices Inc. |
IC AMP DIFF SNGL-SUP 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.840 |
|
Voltage | Analog | Differential | 200µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Exar Corporation |
SENSOR
|
pacchetto: 24-WFQFN Exposed Pad |
Azione4.368 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
||
ams |
IC TXRX DAC LIN 32MLF
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.408 |
|
- | - | 4-Wire Serial | 27mA | -40°C ~ 115°C | Surface Mount | 32-VFQFN Exposed Pad | 32-MLP (5x5) |
||
Microchip Technology |
IC THERMOCOUPLE TO I2C 20MQFN
|
pacchetto: 20-VQFN Exposed Pad |
Azione6.032 |
|
Thermocouple | Digital | I2C | 300µA | -40°C ~ 125°C | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
||
Analog Devices Inc. |
IC THRMOCPLE AMP 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.736 |
|
Differential | Analog | - | 180µA | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Maxim Integrated |
IC PRECISION SIGNAL COND 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.192 |
|
- | - | Digital | 2.5mA | -40°C ~ 125°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Maxim Integrated |
IC CURR LOOP PROT 4-20MA 6TDFN
|
pacchetto: - |
Azione5.616 |
|
- | - | - | - | - | - | - | - |
||
NXP |
IC SENSOR DBUS DSI 2.02 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione5.216 |
|
Analog | Digital | Bus | 4mA | -40°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
NXP |
IC SENSOR DBUS DSI 2.02 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.720 |
|
Analog | Digital | Bus | 4mA | -40°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC DRVR LVL SHIFTER
|
pacchetto: 28-UFQFN Exposed Pad |
Azione6.304 |
|
- | - | SPI | 200µA | -40°C ~ 85°C | Surface Mount | 28-UFQFN Exposed Pad | 28-UQFN (4x4) |
||
Maxim Integrated |
IC HALL EFFECT SENSOR DL 10UMAX
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione185.016 |
|
Voltage | Logic | 2-Wire | 1.3mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Rohm Semiconductor |
IC PREAMP HBD PIR SENSOR 14SSOP
|
pacchetto: 14-LSSOP (0.173", 4.40mm Width) |
Azione6.976 |
|
- | - | - | 300µA | -30°C ~ 75°C | Surface Mount | 14-LSSOP (0.173", 4.40mm Width) | 14-SSOPB |
||
Microchip Technology |
IC SMOKE DETECTOR ION 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.144 |
|
Ionization | Voltage | - | 90µA | -10°C ~ 60°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Diodes Incorporated |
PIR CONTROLLER SO-16
|
pacchetto: - |
Azione6.896 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
||
Texas Instruments |
IC TIME TO DIGITAL CONV 25-NFBGA
|
pacchetto: 25-TFBGA |
Azione5.136 |
|
- | - | SPI | 2.7mA | -40°C ~ 85°C | Surface Mount | 25-TFBGA | 25-NFBGA (4x4) |
||
Texas Instruments |
IC AFE ULTRA SENSING 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione2.720 |
|
Ultrasound | Digital | SPI | 2.8mA | -40°C ~ 125°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Semtech Corporation |
IC DAS ADC 16BIT I2C/SRL
|
pacchetto: 16-WQFN Exposed Pad |
Azione27.318 |
|
Differential | Digital | I2C | - | -40°C ~ 125°C | Surface Mount | 16-WQFN Exposed Pad | 16-MLPQ-EP (4x4) |
||
Texas Instruments |
LINEAR OPERATIONAL (OP) AMP
|
pacchetto: - |
Azione7.504 |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
onsemi |
ANALOG CIRCUIT, 1 FUNC, PDSO3
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |