Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC PROXMITY SENSOR 2CH 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.232 |
|
Digital | Digital | JTAG, Serial | 100µA | -40°C ~ 105°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC SMOKE DETECT PHOTOELEC 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione6.228 |
|
Ionization | Voltage | - | 12µA | -10°C ~ 60°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
NXP |
IC SMOKE DETECT PHOTOELEC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.784 |
|
Photoelectric | Voltage | - | 12µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
NXP |
IC SMOKE DETECTOR WITH I/O 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione8.796 |
|
Photoelectric | Voltage | - | 8µA | -10°C ~ 60°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
NXP |
IC SMOKE DETECT WITH I/O 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.264 |
|
Photoelectric | Voltage | - | 8µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Analog Devices Inc. |
IC CCD SGNL PROCESSOR 112CSBGA
|
pacchetto: 112-LFBGA, CSPBGA |
Azione21.780 |
|
- | - | - | - | -25°C ~ 85°C | Surface Mount | 112-LFBGA, CSPBGA | 112-CSPBGA (8x8) |
||
Melexis Technologies NV |
IC SENSOR INTERFACE PROGR 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.440 |
|
- | - | - | - | - | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
IC 4-20MA I-TRANSMITTER 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione5.264 |
|
Differential | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
Exar Corporation |
SENSOR
|
pacchetto: 24-WFQFN Exposed Pad |
Azione4.496 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
||
Texas Instruments |
IC TIME TO DIGITAL CONV 25-NFBGA
|
pacchetto: 25-TFBGA |
Azione7.088 |
|
- | - | SPI | 2.7mA | -40°C ~ 85°C | Surface Mount | 25-TFBGA | 25-NFBGA (4x4) |
||
Maxim Integrated |
IC TRANSLATOR OCT DGTL 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad |
Azione2.544 |
|
Digital | Digital | - | 1.6mA | -40°C ~ 125°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) Exposed Pad | 38-TSSOP-EP |
||
Maxim Integrated |
IC HALL EFFECT SENSOR DL 10UMAX
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione5.872 |
|
Voltage | Logic | 2-Wire | 1.3mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Diodes Incorporated |
PIR CONTROLLER PDIP-16
|
pacchetto: - |
Azione3.312 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
||
Rohm Semiconductor |
IC SIGNAL PROCESSOR 8MSOP
|
pacchetto: - |
Azione16.812 |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC THERMOCOUPLE A W/COMP 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.144 |
|
Differential | Analog | - | 250µA | 25°C ~ 100°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC HORN DRIVER DUAL 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione16.416 |
|
Logic | Logic | Logic | 100nA | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Analog Devices Inc. |
IC RTD SIGNAL COND HYBRID 38-DIP
|
pacchetto: 38-DIP (0.800", 20.32mm), 15 Leads |
Azione5.872 |
|
Voltage | Voltage | 3-Wire | 12mA | -40°C ~ 85°C | Through Hole | 38-DIP (0.800", 20.32mm), 15 Leads | - |
||
Analog Devices Inc. |
IC SGNL COND 4-20MA TX 20-CDIP
|
pacchetto: 20-CDIP (0.300", 7.62mm) |
Azione24.456 |
|
Voltage | Voltage | 3-Wire | 20mA | -40°C ~ 85°C | Through Hole | 20-CDIP (0.300", 7.62mm) | 20-CDIP |
||
Analog Devices Inc. |
IC SGNL COND 4-20MA TX 16-CDIP
|
pacchetto: 16-CDIP (0.300", 7.62mm) |
Azione56.292 |
|
Voltage | Voltage | - | 23mA | -40°C ~ 85°C | Through Hole | 16-CDIP (0.300", 7.62mm) | 16-CDIP |
||
Analog Devices Inc. |
IC TRANSMITTER 4-20MA 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione97.800 |
|
Voltage | Voltage | - | 23mA | 0°C ~ 70°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Linear Technology |
IC COMPENSATR THERM MCRPWR 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione20.412 |
|
Voltage | Voltage | - | 150µA | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ams |
IC ULTRASONIC FLOW SENSOR 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.272 |
|
Digital | Digital | SPI, UART | 1.9µA | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Melexis Technologies NV |
MLX90308LDF
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | Serial | - | 5 mA | -40°C ~ 150°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Renesas Electronics Corporation |
PQFN / 24 / 4X4MM G1 - TAPE&REE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
10-BIT CCD SIGNAL PROCESSOR
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | Serial | - | - | -20°C ~ 75°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |