Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER MUX 2:2 24-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione7.888 |
|
1 | 2:2 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 250MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.392 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | HCSL | 250MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2.7GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.632 |
|
1 | 2:4 | Yes/Yes | ECL, HSTL, LVPECL | ECL, LVPECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:8 350MHZ 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione7.568 |
|
1 | 1:8 | Yes/Yes | LVDS, LVPECL, LVTTL | LVPECL | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 650MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.632 |
|
1 | 1:10 | No/No | AVCMOS | AVCMOS | 650MHz | 1.71 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.208 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, PECL | PECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.000 |
|
2 | 1:4 | No/No | CMOS, TTL | TTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 4GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione18.000 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.016 |
|
1 | 8:8 | Yes/Yes | 3-State | LVTTL | 80MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
NXP |
IC CLK BUFFER 1:6 100MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione54.408 |
|
1 | 1:6 | Yes/No | TTL, Crystal | LVCMOS | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.632 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:21 400MHZ 52QFN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione7.504 |
|
1 | 1:21 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | HCSL, LVDS | 400MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-QFN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 650MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.448 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 650MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microsemi Corporation |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.328 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.432 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione19.956 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 200MHZ 28QSOP
|
pacchetto: 28-SSOP (0.154", 3.90mm Width) |
Azione7.728 |
|
1 | 1:16 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 100MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.128 |
|
1 | 1:6 | No/No | Crystal | LVCMOS, LVTTL | 100MHz | 1.6 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 200MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione39.780 |
|
1 | 1:5 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Maxim Integrated |
CLOCK DRIVER
|
pacchetto: - |
Azione4.048 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:3/1:6 2GHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.760 |
|
2 | 1:3, 1:6 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK MANANGEMENT
|
pacchetto: - |
Azione6.480 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 16-VFQFPN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.032 |
|
- | - | - | - | - | - | - | - | Surface Mount | 16-WFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.752 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 8-SOIC
|
pacchetto: - |
Azione6.864 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
CLOCK SYNTHESIZE/GENERATOR/PLL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
onsemi |
IC CLOCK BUFFER 1:2 1.5GHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
- | 1:2 | - | - | - | - | - | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUF 1:6 133.33MHZ 40TQFN
|
pacchetto: - |
Azione31.887 |
|
1 | 1:6 | Yes/Yes | HCSL | HCSL | 133.33 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |