Microchip Technology Inc. has announced the launch of the ARM926EJ-S-based SAM9X60D1G-SOM embedded microprocessor running up to 600 MHz, further expanding its Microchip System-on-Module (SOM) portfolio. The software for the SAM9X60D1G-SOM is available with bare metal or RTOS support via MPLABHarmony 3, or with full Linux mainline distribution support.
Microchip Technology Inc. announced the expansion of its serial connection storage controller product lineup, and launched a new SMC 2000 series intelligent storage controller based on Compute Express Link (CXL). Enables the CPU, GPU, and SoC to connect to DDR4 or DDR5 memory using CXL ports. This solution provides more storage bandwidth and higher storage capacity per kernel, and enables modern cpus to optimize application workloads, thereby reducing the overall total cost of ownership of the data center.
The MF-180M has three heat conduction modes: heat conduction, heat radiation and heat flow. If the heat flux sensor is placed on the surface of the material, it will test the sum of the heat of the three modes. If the sensor is located inside the material, it directly tests the heat transfer generated by heat conduction. It is suitable for direct measurement of heat flow inside the material, and also suitable for measurement of radiation flow of refrigerant.
Rohde & Schwarz has released a comprehensive set of coordinated software options for its vector signal generators and signal and spectrum analysers.
Torex Semiconductor Co., Ltd. has developed the XC6810 series of multifunctional ultra-compact charging ICs suitable for supporting wireless power transfer lithium-ion batteries. The XC6810 series are ultra-compact charging ICs for Li-ion batteries, suitable for small wearables, hearables, and IoT devices. It has various functions such as charge and discharge control, wireless power supply support, etc.
TRUMPF Photonic Components, a global leader in Vertical Cavity Surface Emitting Lasers (VCSELs) and photodiode solutions, today announced the launch of a new generation of VCSELs for spectral oxygen sensing. Spectral sensing solutions are arguably the best performing sensing technology for monitoring parameters such as oxygen concentration.
Microchip Technology Inc announced the launch of the industry's first PIC32CM LS60 microcontroller (MCU) integrated with a security subsystem and Arm® TrustZone® Technology in a single package. The new microcontroller integrates Microchip's Trust Platform security subsystem, making it easier to develop end products using a single microcontroller instead of two or more chips.
Allegro has announced an expanded portfolio of three-phase non-inductive BLDC gate drives with the new A89332 and A89332-1 designed to meet the changing needs of today's data center cooling systems, providing designers with more flexible options. These drivers feature innovative integrated power off braking (PLB) (A89332) and AC power off (A89332-1) capabilities, enabling a more compact high-airflow fan design that improves thermal efficiency, reduces power consumption and data center costs.
Nisshinbo Microelectronics Co., Ltd. began mass production of two RF Low Noise Amplifiers (LNAs), NT1191 and NT1192, for high-precision GNSS (GPS, GL ONASS, Galileo, Beidou, etc.). The NT1191 is a wideband LNA supporting multi-band GNSS (1164MHz to 1610MHz), while the NT1192 is a 1.2 GHz LNA supporting L5/L2/L6 bands (1164MHz to 1300MHz).
Howe group for mobile phones, computers, and other areas of the application continues to provide high-performance solution accumulation, the launch of SCR process characteristics of protective devices, ultra low clamping voltage, low junction capacitance characteristics, compared with the conventional process TVS protective effect is better, and does not affect the signal integrity, can be more effective to protect the USB port from the influence of the transient overvoltage, Strengthen and protect related electronic products and equipment to improve consumer experience.
Infineon Technologies Bipolar GmbH & Co. KG is further expanding its high-power Prime Switch product lineup with the launch of new opt-on IGBT (PPI) in ceramic plate package with internal continuous current diode (FWD). Designed for transmission and distribution applications, the PPI is ideal for high-current modular multilevel converters (MMCS), medium-voltage drivers, DC grid circuit breakers, wind power converters, and traction systems
Infineon Technologies has released the new 1700 V TRENCH STOP™ IGBT7 module in EconoDUAL™ 3 standard industrial packaging. With this new chip technology, the EconoDUAL 3 module delivers industry-leading 900 A and 750 A current ratings, further extending the inverter's power range. The module can be widely used in wind power, motor drive, static reactive power generator (SVG) and other applications.
C&K expands its KSC product line with new members with plastic contacts and up to 3 million operation lives. The KSC11 uses a hard plastic contact to provide a high touch rate without sacrificing its service life. The KSC11 lasts three times as long as its competitors' switches, which have a maximum life of 1m times.
Infineon Technologies AG has launched the new XENSIV™ PAS CO2 Shield2Go evaluation board for air quality monitoring and on-demand ventilation control to help achieve energy savings. This new evaluation board is part of Infineon's Shield2Go product portfolio. The product portfolio covers sensors, microcontrollers and safety ICs, which can be freely combined as part of integrated prototyping.
Renesas Electronics, a global semiconductor solutions provider, announced the launch of the RZ/A3UL microprocessor (MPU) family, which enables high-definition human-machine interface (HMI) and fast startup capabilities for applications requiring high throughput and real-time capabilities.
Microchip Technology Inc. announced the launch of its SAMA7G54 microprocessor (MPU) based on Arm Cortex A7, which operates at frequencies up to 1 GHz. The SAMA7G54 is equipped with both the MIPI® CSI-2 camera interface and a traditional parallel camera interface, enabling developers to design low-power stereo applications with more accurate depth perception.
TDK has introduced the CLT32 series power inductors with a new design. In addition to being extremely compact in size and excellent in electrical specification, the range of inductance from 17 nH to 440 nH, saturation current range from 13.5 A to 60 A, and operating temperature range from -40 °C to 165 °C (including inductance rise) are available in nine models. The size is extremely compact, the board area is only 3.2 x 2.5mm, the height is 2.5mm, can be regarded as the most compact SMT power inductor in the same kind of products.
Renesas Electronics announces the launch of the RG3MxxB12 family of I3C smart switching devices for next-generation server motherboards and other infrastructure devices -- new chips that greatly improve scalability and reliability while reducing the complexity of high-performance system design. Enable an I3C control plane network with multiple originator controllers, such as cpus and substrate management controllers /BMC, to support goals in a large physical network running at full speed by improving signal integrity and reducing capacitive load.
