Pagina 100 - Nuove Tecnologie | Heisener Electronics
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Nuove Tecnologie

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2022-07-31, First Optical 1000BASE-RH SFP Module Design

KDPOF has designed and validated the first 1000BASE-RH SFP module for vehicle optical gigabit connectivity. The design of this new small form-factor pluggable transceiver module is based on a standard SFP supporting MSA registers through I2C bus.The module can function at 100 and 1,000Mb/s. It incorporates the whole 1000BASE-RHC PHY and the header connector for SI-POF optical harness.

Technology Cover

2022-07-31, A new ultra - miniature ultra - low phase noise crystal oscillator

Mercury Electronics Europe has released a new range of ultra-miniature, ultra-low phase noise crystal oscillators. The new surface mount HJ22 oscillator provides a 15pF load LVCMOS output from 20 to 50MHz with a typical RMS phase jitter of only 48fs , up to 300fs. They are ideal for embedded automotive applications.

Technology Cover

2022-07-30, Micron Ships World's First 232-Layer NAND, Further Consolidating Technology Leadership

Cutting-edge innovations deliver TLC NAND with the highest performance and wafer density, all in the industry's smallest packages

Technology Cover

2022-07-30, Nanochip launches a new isolated Sigma-Delta modulator isolated sampling chip

The isolated Sigma-Delta modulator NSi1303 and NSi1305 series chips newly developed by NOVOSENSE have extremely low offset error and temperature drift, high common mode immunity up to 150kV/us and 5000Vrms electrical isolation certified by UL1577 performance, the above techniques are suitable for current-sampling designs for complex high-voltage systems in typical applications in the industrial and automotive markets.

Technology Cover

2022-07-30, element14 and Bourns launch new partnership

element14 and Bourns launch new partnership to meet growing demand for advanced magnetic solutions , EMC compliance equipment, signal transformers, common mode choke coils and ferrite cores, etc.

Technology Cover

2022-07-30, Qorvo Expands Portfolio of Higher Performance and Efficiency 750V SiC FETs for Power Designs

Qorvo introduces seven 750V Silicon Carbide (SiC) FETs in a surface mount D2PAK-7L package. With this package option, Qorvo's SiC FETs can be used for on-board chargers, soft-switching DC/DC converters, battery charging (fast DC and Tailored to fast-growing applications such as IT/server power supplies, it can provide better solutions for high-power applications with higher efficiency, lower conduction losses and superior cost-effectiveness in thermally enhanced packages.

Technology Cover

2022-07-30, Siemens Calibre Platform Extends Early Design Verification Solution

Siemens Digital Industries Software has expanded its integrated circuit (IC) physical verification platform, Calibre, with a range of electronic design automation (EDA) early-stage design verification capabilities that “shift left” the physical and circuit verification tasks to the higher end of the design and verification process. Identify, analyze, and resolve complex IC and system-on-a-chip (SoC) physical verification problems at an early stage, helping IC design teams and companies accelerate tape-out.

Technology Cover

2022-07-30, SmartVision launches two new mobile phone applications SC520CS and SC820CS based on self-developed advanced BSI process platform

Smartphone Electronic Technology Co., Ltd. officially launched the Cellphone Sensor (CS) Series mobile phone application image sensor products SC520CS and SC820CS. Both new products are built with 12-inch wafer technology, equipped with SmartSens' innovative SFCPixel patented technology and ultra-low noise peripheral reading circuit technology

Technology Cover

2022-07-29, ScioSense releases new air quality sensor to empower healthy life

ScioSense announced that the latest product that can accurately detect air quality, the APC1 all-in-one environmental combination sensor, will be the first to be used in related products in China. After being used in related products in China, this environmental combination sensor, which is only the size of a matchbox but has excellent performance, can help hundreds of millions of people get cleaner and healthier air quality.

Technology Cover

2022-07-29, Infineon launches WLC1115 transmitter controller IC

Infineon has announced the WLC1115 transmitter controller IC, the first product in the new WLC line of controllers, which uses inductive wireless charging technology. In addition, Infineon offers a WLC1115-based and Qi V1.3.2 certified MP A11 wireless charging transmitter reference design solution that can be used in a variety of applications such as smartphones, smart speakers, docking stations, display holders, industrial or medical device accessories.

Technology Cover

2022-07-29, Keysight Technologies Receives First O-RAN Certification for MICAS O-RU Devices

The Keysight Open Radio Architecture (KORA) solution helped MICAS achieve its first O-RAN certification for its 5G O-RU. The O-RAN conformance certification is issued by the OTIC Certification Center of Zhongguancun Pan-Joint Institute. Keysight Technologies provides advanced design and verification solutions designed to accelerate innovation and create a secure, connected world.

Technology Cover

2022-07-29, Fibocom Wireless releases AI smart module SCA825-W, powerful computing power helps AIoT applications unleash unlimited potential

Fibocom Wireless has officially launched the high computing power AI module SCA825-W based on the Qualcomm QCS8250 chip platform, which will be fully applied to the AIoT field of complex video image analysis such as networked medical care, digital signage, smart retail, and video collaboration. Guanghetong AI module enriches the intelligent module product line, AI performance generates strong potential energy, and has accumulated a lot in the field of digital economy applications.

Technology Cover

2022-07-29, Colored LEDs available in a variety of spectral options

Cree LED Colour LEDs, available now from Mouser, offer a wide range of spectral options for general and speciality lighting applications. These LEDs provide a small package size, low power consumption and are application-optimised to facilitate the lowest system cost. The LEDs are easy-to-choose, simple to use, and created to provide beautiful, long-lasting, energy-efficient light.

Technology Cover

2022-07-29, The product has been operating in low earth orbit for more than 16 years

Triad RF Systems' experience in the CubeSat market led its products to travel in Low Earth Orbit (LEO) for over 16 years of combined operating time.

Technology Cover

2022-07-28, Vishay Introduces AEC-Q200 Qualified DC-Link Metallized Polypropylene Film Capacitors

Vishay Intertechnology, Inc. announced the launch of a new series of low-profile AEC-Q200 qualified DC-Link metallized polypropylene film capacitors, the MKP1848Se DC-Link. It is an advanced device in the industry. It has been tested for up to 56 days under the condition of rated voltage, temperature of 60 C / relative humidity of 93 %, and it can meet the application requirements of automotive high-humidity environment.

Technology Cover

2022-07-28, Magnetic Sensors: TDK Introduces Small Redundant Analog TMR Angle Sensors for Safety-Related Applications

The TAS4240 is a compact, cost-effective, redundant angle and position sensing sensor based on a half-bridge TMR Extremely stable over temperature, magnetic field range, and lifetime Provides ideal for safety-related applications such as power steering motors Precise and redundant rotor position measurement

Technology Cover

2022-07-28, Infineon Hybrid Flyback Controller XDP™ and CoolGaN™ IPS Deep Fusion

Infineon Technologies AG has released an innovative solution that integrates a hybrid flyback (HFB) controller XDP™ digital power controller with a 600 V CoolGaN™ integrated power stage (IPS) product (IGI60F1414A1L) , which can be used to design energy-efficient, high-power-density chargers and adapters.

Technology Cover

2022-07-28, Mouser and Microchip release new e-book

Mouser Electronics Announces the Release of a New eBook, "Effortless Embedded Solutions," in collaboration with Microchip Technology, exploring the use of embedded microcontrollers in device design