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Prodotti Xilinx Inc.

Record 7.167
Pagina  19/256
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
XC17256EPDG8C
Xilinx Inc.

IC PROM SERIAL 256K 8-DIP

  • Programmable Type: OTP
  • Memory Size: 256Kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
pacchetto: 8-DIP (0.300", 7.62mm)
Azione2.880
XC17S30ASO20C
Xilinx Inc.

IC PROM SER 30000 C-TEMP 20-SOIC

  • Programmable Type: OTP
  • Memory Size: 300kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
pacchetto: 20-SOIC (0.295", 7.50mm Width)
Azione7.136
XC17S20PD8I
Xilinx Inc.

IC PROM PROG I-TEMP 5V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 200kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
pacchetto: 8-DIP (0.300", 7.62mm)
Azione4.624
XQR17V16CK44V
Xilinx Inc.

IC MEM PROM 16MB 3.3V 44PIN

  • Programmable Type: OTP
  • Memory Size: 16Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Package / Case: 44-CCC (J-Lead)
  • Supplier Device Package: 44-CCCP (16.51x16.51)
pacchetto: 44-CCC (J-Lead)
Azione7.120
XCZU6EG-L2FFVB1156E
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione5.040
XCZU7CG-2FFVC1156I
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione2.080
XCZU9CG-L1FFVC900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione5.040
XCZU4EG-1SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
pacchetto: 784-BBGA, FCBGA
Azione2.784
XC7Z015-3CLG485E
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 485BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 866MHz
  • Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 485-CSBGA (19x19)
pacchetto: 484-LFBGA, CSPBGA
Azione3.856
XC6SLX150-N3FG900C
Xilinx Inc.

IC FPGA 576 I/O 900FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 576
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione7.712
hot XC2V6000-6FFG1152C
Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

  • Number of LABs/CLBs: 8448
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 2654208
  • Number of I/O: 824
  • Number of Gates: 6000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione3.952
hot XCV150-5PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 166
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione12.756
XC4085XL-09BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
pacchetto: 432-LBGA, Metal
Azione4.976
XC4028XL-2HQ160C
Xilinx Inc.

IC FPGA 129 I/O 160HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 129
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP Exposed Pad
  • Supplier Device Package: 160-PQFP (28x28)
pacchetto: 160-BQFP Exposed Pad
Azione3.840
XC4020XL-1PQ240I
Xilinx Inc.

IC FPGA 192 I/O 240QFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 192
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione6.576
XC4020XL-09PQ208C
Xilinx Inc.

IC FPGA 160 I/O 208QFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 160
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione7.440
XC7VX1140T-1FL1928C
Xilinx Inc.

IC FPGA 480 I/O 1928FCBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 1139200
  • Total RAM Bits: 69304320
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1928-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione7.568
XC7VX690T-L2FFG1930E
Xilinx Inc.

IC FPGA 1000 I/O 1930FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 1000
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1930-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione4.336
hot XC6VSX475T-1FFG1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 37200
  • Number of Logic Elements/Cells: 476160
  • Total RAM Bits: 39223296
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione5.424
XQ7VX330T-1RF1157M
Xilinx Inc.

IC FPGA VIRTEX-7 330K 1157BGA

  • Number of LABs/CLBs: 25500
  • Number of Logic Elements/Cells: 326400
  • Total RAM Bits: 27648000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione5.184
XC5VLX155-1FFG1760C
Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7077888
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione5.248
XCKU3P-2FFVD900E
Xilinx Inc.

XCKU3P-2FFVD900E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 26828800
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione3.392
XC5VLX50-2FFG1153C
Xilinx Inc.

IC FPGA 560 I/O 1153FCBGA

  • Number of LABs/CLBs: 3600
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 1769472
  • Number of I/O: 560
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1153-BBGA, FCBGA
  • Supplier Device Package: 1153-FCBGA (35x35)
pacchetto: 1153-BBGA, FCBGA
Azione2.240
hot XC2VP7-6FFG896C
Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

  • Number of LABs/CLBs: 1232
  • Number of Logic Elements/Cells: 11088
  • Total RAM Bits: 811008
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione6.288
XC7A15T-L1CSG324I
Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione5.184
hot XC7K325T-2FBG676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione3.552
hot XC95288XL-10CS280C
Xilinx Inc.

IC CPLD 288MC 10NS 280CSBGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 192
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 280-TFBGA, CSPBGA
  • Supplier Device Package: 280-CSBGA (16x16)
pacchetto: 280-TFBGA, CSPBGA
Azione4.944
XA7S25-2CSGA225I
Xilinx Inc.

XA7S25-2CSGA225I

  • Number of LABs/CLBs: 1825
  • Number of Logic Elements/Cells: 23360
  • Total RAM Bits: 1658880
  • Number of I/O: 150
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
pacchetto: 225-LFBGA, CSPBGA
Azione6.048