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Prodotti Xilinx Inc.

Record 7.167
Pagina  21/256
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
XCMECH-FF668
Xilinx Inc.

FF668 MECHANICAL SAMPLE

  • Type: Mechanical Sample
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione6.080
XC17128ELVO8I
Xilinx Inc.

IC 3V SER CFG PROM 128K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 128kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
pacchetto: 8-SOIC (0.154", 3.90mm Width)
Azione6.736
hot XC17256EPC20C
Xilinx Inc.

IC SERIAL CFG PROM 256K 20-PLCC

  • Programmable Type: OTP
  • Memory Size: 256Kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
pacchetto: 20-LCC (J-Lead)
Azione6.480
XCZU9CG-L1FFVB1156I
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione3.984
XCZU2EG-3SFVA625E
Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
pacchetto: 625-BFBGA, FCBGA
Azione2.768
XC7Z030-2FFG676E
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione7.440
XC5VSX50T-1FFG665CES
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 4080
  • Number of Logic Elements/Cells: 52224
  • Total RAM Bits: 4866048
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
pacchetto: 665-BBGA, FCBGA
Azione2.752
hot XCV1000E-7FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione6.276
hot XCS20XL-5VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 77
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
pacchetto: 100-TQFP
Azione6.240
XC4008E-3PG191C
Xilinx Inc.

IC FPGA 144 I/O 191CPGA

  • Number of LABs/CLBs: 324
  • Number of Logic Elements/Cells: 770
  • Total RAM Bits: 10368
  • Number of I/O: 144
  • Number of Gates: 8000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 191-BCPGA
  • Supplier Device Package: 191-CPGA (47.25x47.25)
pacchetto: 191-BCPGA
Azione7.552
hot XC4003E-4VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 3000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
pacchetto: 100-TQFP
Azione7.776
XCVU080-3FFVD1517E
Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

  • Number of LABs/CLBs: 55714
  • Number of Logic Elements/Cells: 975000
  • Total RAM Bits: 51200000
  • Number of I/O: 338
  • Number of Gates: -
  • Voltage - Supply: 0.970 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione6.720
XCKU095-1FFVB2104I
Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

  • Number of LABs/CLBs: 67200
  • Number of Logic Elements/Cells: 1176000
  • Total RAM Bits: 60518400
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
pacchetto: 2104-BBGA, FCBGA
Azione7.744
XC7VX485T-2FFG1761C
Xilinx Inc.

IC FPGA 700 I/O 1761FCBGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 700
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1761-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione2.128
hot XC5VLX155T-1FF1136I
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7815168
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
pacchetto: 1136-BBGA, FCBGA
Azione4.224
XC6VLX240T-L1FFG784I
Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
pacchetto: 784-BBGA, FCBGA
Azione6.352
XC5VLX85-3FF676C
Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

  • Number of LABs/CLBs: 6480
  • Number of Logic Elements/Cells: 82944
  • Total RAM Bits: 3538944
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione4.096
hot XC2VP30-6FFG896C
Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

  • Number of LABs/CLBs: 3424
  • Number of Logic Elements/Cells: 30816
  • Total RAM Bits: 2506752
  • Number of I/O: 556
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione4.896
XQ6SLX150T-3CSG484I
Xilinx Inc.

IC FPGA SPARTAN-6Q 484-CSBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.2 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
pacchetto: 484-FBGA, CSPBGA
Azione7.776
hot XC2VP4-5FGG456C
Xilinx Inc.

IC FPGA 248 I/O 456FBGA

  • Number of LABs/CLBs: 752
  • Number of Logic Elements/Cells: 6768
  • Total RAM Bits: 516096
  • Number of I/O: 248
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
pacchetto: 456-BBGA
Azione5.456
hot XC2S100-6PQ208C
Xilinx Inc.

IC FPGA 140 I/O 208QFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 140
  • Number of Gates: 100000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione5.504
hot XC3S400-4PQ208C
Xilinx Inc.

IC FPGA 141 I/O 208QFP

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 294912
  • Number of I/O: 141
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione4.224
hot XC3S50-4PQ208C
Xilinx Inc.

IC FPGA 124 I/O 208QFP

  • Number of LABs/CLBs: 192
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 73728
  • Number of I/O: 124
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione6.048
XC7A200T-1FBG484C
Xilinx Inc.

IC FPGA ARTIX7 285 I/O 484FCBGA

  • Number of LABs/CLBs: 16825
  • Number of Logic Elements/Cells: 215360
  • Total RAM Bits: 13455360
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
pacchetto: 484-BBGA, FCBGA
Azione8.028
XC3S50A-4TQG144I
Xilinx Inc.

IC FPGA 108 I/O 144TQFP

  • Number of LABs/CLBs: 176
  • Number of Logic Elements/Cells: 1584
  • Total RAM Bits: 55296
  • Number of I/O: 108
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione9.672
hot XC95216-15HQ208C
Xilinx Inc.

IC CPLD 216MC 15NS 208HQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 12
  • Number of Macrocells: 216
  • Number of Gates: 4800
  • Number of I/O: 166
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP Exposed Pad
Azione6.112
XC7Z030-2FF676I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione3.360
XCVU9P-3FSGD2104E
Xilinx Inc.

XCVU9P-3FSGD2104E

  • Number of LABs/CLBs: 147780
  • Number of Logic Elements/Cells: 2586150
  • Total RAM Bits: 391168000
  • Number of I/O: 676
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
pacchetto: 2104-BBGA, FCBGA
Azione5.200