Pagina 16 - Prodotti Xilinx Inc. | Heisener Electronics
Contattaci
SalesDept@heisener.com +86-755-83210559-827
Language Translation

* Please refer to the English Version as our Official Version.

Prodotti Xilinx Inc.

Record 7.167
Pagina  16/256
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
XC7Z100-L2FFG1156I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 1156BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione4.576
XCZU3EG-2SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
pacchetto: 784-BBGA, FCBGA
Azione3.936
XC7Z030-3FBG676E
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1GHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione7.600
XC7Z014S-2CLG400I
Xilinx Inc.

IC FPGA SOC 200I/O 400BGA

  • Architecture: MCU, FPGA
  • Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 766MHz
  • Primary Attributes: Artix?-7 FPGA, 65K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
pacchetto: 400-LFBGA, CSPBGA
Azione5.616
XC6SLX45-N3FG676C
Xilinx Inc.

IC FPGA 358 I/O 676FCBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 358
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione7.088
XC2V3000-5FGG676C
Xilinx Inc.

IC FPGA 484 I/O 676FBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 484
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
pacchetto: 676-BGA
Azione4.944
XC4062XL-2BG432I
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 352
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
pacchetto: 432-LBGA, Metal
Azione5.776
XC4028XL-1BG352I
Xilinx Inc.

IC FPGA 256 I/O 352MBGA

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 256
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
pacchetto: 352-LBGA, Metal
Azione2.352
XC6VHX380T-3FF1923C
Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

  • Number of LABs/CLBs: 29880
  • Number of Logic Elements/Cells: 382464
  • Total RAM Bits: 28311552
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione3.072
XC6VHX380T-2FFG1924E
Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

  • Number of LABs/CLBs: 29880
  • Number of Logic Elements/Cells: 382464
  • Total RAM Bits: 28311552
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione2.192
XCKU085-1FLVF1924I
Xilinx Inc.

IC FPGA 624 I/O 1924FCBGA

  • Number of LABs/CLBs: 62190
  • Number of Logic Elements/Cells: 1088325
  • Total RAM Bits: 58265600
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione6.112
hot XC5VFX100T-2FF1136I
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 102400
  • Total RAM Bits: 8404992
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
pacchetto: 1136-BBGA, FCBGA
Azione6.640
XC6VLX550T-1FF1759C
Xilinx Inc.

IC FPGA 840 I/O 1759FCBGA

  • Number of LABs/CLBs: 42960
  • Number of Logic Elements/Cells: 549888
  • Total RAM Bits: 23298048
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione5.680
XC2VP50-7FF1148C
Xilinx Inc.

IC FPGA 812 I/O 1148FCBGA

  • Number of LABs/CLBs: 5904
  • Number of Logic Elements/Cells: 53136
  • Total RAM Bits: 4276224
  • Number of I/O: 812
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
pacchetto: 1148-BBGA, FCBGA
Azione6.816
XCKU035-3FBVA900E
Xilinx Inc.

IC FPGA 468 I/O 900FCBGA

  • Number of LABs/CLBs: 25391
  • Number of Logic Elements/Cells: 444343
  • Total RAM Bits: 19456000
  • Number of I/O: 468
  • Number of Gates: -
  • Voltage - Supply: 0.970 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione3.664
XC4VLX40-11FF1148I
Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

  • Number of LABs/CLBs: 4608
  • Number of Logic Elements/Cells: 41472
  • Total RAM Bits: 1769472
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
pacchetto: 1148-BBGA, FCBGA
Azione5.152
XC6VLX75T-L1FF484I
Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

  • Number of LABs/CLBs: 5820
  • Number of Logic Elements/Cells: 74496
  • Total RAM Bits: 5750784
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
pacchetto: 484-BBGA, FCBGA
Azione4.320
hot XC4VFX12-11FF668I
Xilinx Inc.

IC FPGA 320 I/O 668FCBGA

  • Number of LABs/CLBs: 1368
  • Number of Logic Elements/Cells: 12312
  • Total RAM Bits: 663552
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
pacchetto: 668-BBGA, FCBGA
Azione5.424
XC3S5000-4FG676C
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 8320
  • Number of Logic Elements/Cells: 74880
  • Total RAM Bits: 1916928
  • Number of I/O: 489
  • Number of Gates: 5000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione4.256
hot XC3S2000-4FG676C
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 5120
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 737280
  • Number of I/O: 489
  • Number of Gates: 2000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione5.936
hot XC3S500E-5FTG256C
Xilinx Inc.

IC FPGA 190 I/O 256FTBGA

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 190
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione10.200
hot XC3S400AN-5FGG400C
Xilinx Inc.

IC FPGA 311 I/O 400FBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 368640
  • Number of I/O: 311
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
pacchetto: 400-BGA
Azione5.936
XC6SLX16-N3CSG324C
Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 232
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione7.472
hot XC7A50T-1FGG484C
Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione9.036
hot XC95216-10PQG160C
Xilinx Inc.

IC CPLD 216MC 10NS 160QFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 12
  • Number of Macrocells: 216
  • Number of Gates: 4800
  • Number of I/O: 133
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
pacchetto: 160-BQFP
Azione5.280
XC2C384-7FG324C
Xilinx Inc.

IC CPLD 384MC 7.1NS 324FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.1ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 24
  • Number of Macrocells: 384
  • Number of Gates: 9000
  • Number of I/O: 240
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 324-BBGA
  • Supplier Device Package: 324-FBGA (23x23)
pacchetto: 324-BBGA
Azione3.936
hot XCR3032XL-10CS48C
Xilinx Inc.

IC CPLD 32MC 9.1NS 48CSP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 750
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
pacchetto: 48-FBGA, CSPBGA
Azione316.824
hot XC95288XL-6TQG144C
Xilinx Inc.

IC CPLD 288MC 6NS 144TQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 6.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 117
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione5.168