Pagina 45 - Prodotti NXP - PMIC - Gestione potenza - Specializzata | Heisener Electronics
Contattaci
SalesDept@heisener.com +86-755-83210559-827
Accesso/Registrati
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Carrello 0

Prodotti NXP - PMIC - Gestione potenza - Specializzata

Record 1.370
Pagina  45/49
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
NE57814DD,518
NXP

IC DDR TERM W/STANDBY 8-SOIC

  • Applications: Memory, DDR/DDR2 Regulator
  • Current - Supply: 14mA
  • Voltage - Supply: 1.6 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
  • Supplier Device Package: 8-HSO
pacchetto: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Azione4.032
14mA
1.6 V ~ 3.6 V
0°C ~ 70°C
Surface Mount
8-SOIC (0.154", 3.90mm Width) Exposed Pad
8-HSO
hot MC34708VMR2
NXP

IC POWER MANAGEMENT 206MAPBGA

  • Applications: General Purpose
  • Current - Supply: -
  • Voltage - Supply: 1.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 206-LFBGA
  • Supplier Device Package: 206-MAPBGA (13x13)
pacchetto: 206-LFBGA
Azione2.000
-
1.8 V ~ 4.5 V
-40°C ~ 85°C
Surface Mount
206-LFBGA
206-MAPBGA (13x13)
TDA3683J/N2S,112
NXP

IC REG MULTIPLE VOLTAGE DBS23P

  • Applications: Ignition Buffer, Regulator
  • Current - Supply: 300µA
  • Voltage - Supply: 9 V ~ 18 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 23-SIP Formed Leads
  • Supplier Device Package: DBS23P
pacchetto: 23-SIP Formed Leads
Azione7.392
300µA
9 V ~ 18 V
-40°C ~ 85°C
Through Hole
23-SIP Formed Leads
DBS23P
MCZ33789BAE
NXP

IC SBC W/PWR SUPPLY 64LQFP

  • Applications: Automotive Airbag System
  • Current - Supply: -
  • Voltage - Supply: 5.2 V ~ 20 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP (10x10)
pacchetto: 64-LQFP Exposed Pad
Azione7.840
-
5.2 V ~ 20 V
-40°C ~ 125°C
Surface Mount
64-LQFP Exposed Pad
64-LQFP (10x10)
MCZ33789BAER2
NXP

IC SBC W/PWR SUPPLY 64LQFP

  • Applications: Automotive Airbag System
  • Current - Supply: -
  • Voltage - Supply: 5.2 V ~ 20 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP (10x10)
pacchetto: 64-LQFP Exposed Pad
Azione4.224
-
5.2 V ~ 20 V
-40°C ~ 125°C
Surface Mount
64-LQFP Exposed Pad
64-LQFP (10x10)
hot MC34905CS5EK
NXP

IC SBC HIGH SPEED CAN 5V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione4.256
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
hot MC34708VKR2
NXP

IC POWER MANAGEMENT 206MAPBGA

  • Applications: General Purpose
  • Current - Supply: -
  • Voltage - Supply: 1.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 206-LFBGA
  • Supplier Device Package: 206-MAPBGA (8x8)
pacchetto: 206-LFBGA
Azione15.000
-
1.8 V ~ 4.5 V
-40°C ~ 85°C
Surface Mount
206-LFBGA
206-MAPBGA (8x8)
hot MC34708VK
NXP

IC POWER MANAGEMENT 206MAPBGA

  • Applications: General Purpose
  • Current - Supply: -
  • Voltage - Supply: 1.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 206-LFBGA
  • Supplier Device Package: 206-MAPBGA (8x8)
pacchetto: 206-LFBGA
Azione3.632
-
1.8 V ~ 4.5 V
-40°C ~ 85°C
Surface Mount
206-LFBGA
206-MAPBGA (8x8)
MWCT1200CFM
NXP

IC MULTI COIL 5W 5V 32QFN

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione5.712
-
-
-
-
-
-
hot MC34905CS3EK
NXP

IC SBC HIGH SPD CAN 3.3V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione5.248
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
MWPR1516CALR
NXP

IC RECEIVER 16KB FLASH 32QFN

  • Applications: Wireless Power Receiver
  • Current - Supply: 120mA
  • Voltage - Supply: 3.5 V ~ 20 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 36-UFBGA, WLCSP
  • Supplier Device Package: 36-WLCSP (3.07x2.98)
pacchetto: 36-UFBGA, WLCSP
Azione4.640
120mA
3.5 V ~ 20 V
-40°C ~ 85°C
Surface Mount
36-UFBGA, WLCSP
36-WLCSP (3.07x2.98)
hot MC34903CS5EK
NXP

IC SBC HIGH SPEED CAN 5V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione6.064
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
MC34903CS3EK
NXP

IC SBC HIGH SPD CAN 3.3V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione5.248
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
MC34905CS5EKR2
NXP

IC SBC HIGH SPEED CAN 5V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione3.408
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
MC13892DJVK
NXP

IC PWR MGMT I.MX35/51 139BGA

  • Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 139-TFBGA
  • Supplier Device Package: 139-PBGA (7x7)
pacchetto: 139-TFBGA
Azione2.112
-
-
-40°C ~ 85°C
Surface Mount
139-TFBGA
139-PBGA (7x7)
hot MC13892CJVK
NXP

IC PWR MGMT I.MX35/51 139BGA

  • Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 139-TFBGA
  • Supplier Device Package: 139-PBGA (7x7)
pacchetto: 139-TFBGA
Azione17.964
-
-
-40°C ~ 85°C
Surface Mount
139-TFBGA
139-PBGA (7x7)
hot MC13892DJVLR2
NXP

IC PWR MGMT I.MX35/51 186BGA

  • Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 186-LFBGA
  • Supplier Device Package: 186-PBGA (12x12)
pacchetto: 186-LFBGA
Azione6.224
-
-
-40°C ~ 85°C
Surface Mount
186-LFBGA
186-PBGA (12x12)
MC13892DJVKR2
NXP

IC PWR MGMT I.MX35/51 139BGA

  • Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 139-TFBGA
  • Supplier Device Package: 139-PBGA (7x7)
pacchetto: 139-TFBGA
Azione3.824
-
-
-40°C ~ 85°C
Surface Mount
139-TFBGA
139-PBGA (7x7)
MC13892CJVLR2
NXP

IC PWR MGMT I.MX35/51 186BGA

  • Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 186-LFBGA
  • Supplier Device Package: 186-PBGA (12x12)
pacchetto: 186-LFBGA
Azione3.360
-
-
-40°C ~ 85°C
Surface Mount
186-LFBGA
186-PBGA (12x12)
hot MC13892CJVKR2
NXP

IC PWR MGMT I.MX35/51 139BGA

  • Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 139-TFBGA
  • Supplier Device Package: 139-PBGA (7x7)
pacchetto: 139-TFBGA
Azione14.856
-
-
-40°C ~ 85°C
Surface Mount
139-TFBGA
139-PBGA (7x7)
MC34903CP5EK
NXP

IC SBC HIGH SPEED CAN 5V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione3.792
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
MC34903CP3EK
NXP

IC SWITCH HIGH SIDE 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
pacchetto: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Azione6.224
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC EP
MC34903CS3EKR2
NXP

IC SBC HIGH SPD CAN 3.3V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione2.016
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
MC34709VKR2
NXP

IC PWR MGMT IMX50/53 130MAPBGA

  • Applications: Processor
  • Current - Supply: 370µA
  • Voltage - Supply: 3 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 130-LFBGA
  • Supplier Device Package: 130-MAPBGA (8x8)
pacchetto: 130-LFBGA
Azione3.792
370µA
3 V ~ 4.5 V
-40°C ~ 85°C
Surface Mount
130-LFBGA
130-MAPBGA (8x8)
MCZ33800EKR2
NXP

IC ENGINE CTRL SW/DVR 54-SOIC

  • Applications: Automotive
  • Current - Supply: 10mA
  • Voltage - Supply: 5 V ~ 36 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 54-SOICW-EP
pacchetto: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Azione3.152
10mA
5 V ~ 36 V
-40°C ~ 125°C
Surface Mount
54-SSOP (0.295", 7.50mm Width) Exposed Pad
54-SOICW-EP
hot MC33814AE
NXP

IC CTRL SMALL ENG 2CYL 48LQFP

  • Applications: Small Engine
  • Current - Supply: 10mA
  • Voltage - Supply: 4.5 V ~ 36 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione4.992
10mA
4.5 V ~ 36 V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC34905CS3EKR2
NXP

IC SBC HIGH SPD CAN 3.3V 32SOIC

  • Applications: System Basis Chip
  • Current - Supply: 2mA
  • Voltage - Supply: 5.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Azione7.616
2mA
5.5 V ~ 28 V
-40°C ~ 125°C
Surface Mount
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC
TDA3681ATH/N1S,518
NXP

IC REG MULTIPLE VOLTAGE 20HSOP

  • Applications: Ignition Buffer, Regulator
  • Current - Supply: 110µA
  • Voltage - Supply: 9.5 V ~ 18 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Supplier Device Package: 20-HSOP
pacchetto: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Azione5.456
110µA
9.5 V ~ 18 V
-40°C ~ 85°C
Surface Mount
20-SOIC (0.433", 11.00mm Width) Exposed Pad
20-HSOP