Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC REG MULTIPLE VOLTAGE 20HSOP
|
pacchetto: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Azione5.296 |
|
110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 20-HSOP |
||
NXP |
IC CTRL SMALL ENG 2CYL 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.192 |
|
10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Azione2.848 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC DVR 8-CH ENGINE CTRL 32-SOIC
|
pacchetto: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Azione2.656 |
|
10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
||
NXP |
IC REG MULTIPLE VOLTAGE SOT475
|
pacchetto: 17-SIP Formed Leads |
Azione33.120 |
|
110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Through Hole | 17-SIP Formed Leads | 17-PDBS |
||
NXP |
IC REG MULTIPLE VOLTAGE SOT243
|
pacchetto: 17-SIP Formed Leads |
Azione5.312 |
|
110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Through Hole | 17-SIP Formed Leads | 17-PDBS |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Azione4.368 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SWITCH HIGH SIDE 32SOIC
|
pacchetto: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Azione7.504 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
||
NXP |
IC CTRL SMALL ENG 1CYL 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione3.024 |
|
10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
IC CTRL SMALL ENG 1CYL 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione2.560 |
|
10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Azione4.528 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SWITCH HIGH SIDE
|
pacchetto: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Azione3.712 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
||
NXP |
IC POWER MANAGEMENT 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.864 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
IC WIRELESS TRANSMITTER 32HVQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.952 |
|
2mA | 3.5 V ~ 5.25 V | -20°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) |
||
NXP |
IC SYSTEM BASIS CHIP 32LQFP
|
pacchetto: 32-LQFP |
Azione136.668 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP 32LQFP
|
pacchetto: 32-LQFP |
Azione376.164 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
pacchetto: 32-LQFP |
Azione6.080 |
|
4.5mA | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
pacchetto: 32-LQFP |
Azione2.224 |
|
4.5mA | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP 32LQFP
|
pacchetto: 32-LQFP |
Azione13.896 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP 32LQFP
|
pacchetto: 32-LQFP |
Azione523.608 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP 32LQFP
|
pacchetto: 32-LQFP |
Azione4.976 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
pacchetto: 32-LQFP |
Azione7.424 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
pacchetto: 32-LQFP |
Azione5.264 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Azione7.920 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SWITCH HIGH SIDE
|
pacchetto: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Azione7.392 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
||
NXP |
IC SOLENOID MON 5-CH 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.560 |
|
1mA | 7 V ~ 17 V | -40°C ~ 125°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
pacchetto: 32-LQFP |
Azione3.984 |
|
4.5mA | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
pacchetto: 32-LQFP |
Azione3.264 |
|
4.5mA | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |