Prodotti NXP - PMIC - Gestione potenza - Specializzata

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Current - Supply	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MC33FS6517NAE	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC34VR500VBES	NXP	REGULATOR, BUCK, QUAD WITH UP TO Applications: Processor Current - Supply: 297µA Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	pacchetto: -	Request a Quote	297µA	2.8V ~ 4.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
MC34VR500VAES	NXP	REGULATOR BUCK QUAD WITH UP TO 4 Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	pacchetto: -	Request a Quote	15mA	2.8V ~ 4.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
MC33FS6518CAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC34VR500V9ES	NXP	REGULATOR BUCK QUAD WITH UP TO 4 Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	pacchetto: -	Request a Quote	15mA	2.8V ~ 4.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
MFS2622AMBA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	pacchetto: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MFS2621AMDABADR2	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: - Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	pacchetto: -	Request a Quote	-	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC33FS6517CAE	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33PF8100F3ES	NXP	POWER MANAGEMENT IC, I.MX8, PRE- Applications: Processor Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	10µA	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8510A0ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS8610BMBA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	-	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MC33PF8200D2ESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MPF5024CVNA0ES	NXP	POWER MANAGEMENT IC, PRE-PROG, 4 Applications: High Performance i.MX 8 Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-VFQFN Exposed Pad	40-HVQFN (6x6)
MWCT1012VLFR	NXP	32BIT 64K FLASH 2KB FLEX Applications: Wireless Power Transmitter Current - Supply: 1.7mA Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	pacchetto: -	Request a Quote	1.7mA	3V ~ 3.6V	-40°C ~ 105°C (TA)	Surface Mount	48-LQFP	48-LQFP (7x7)
MFS5600AMEA0ESR2	NXP	DUAL 36V AUTOMOTIVE DC-DC CONTRO Applications: - Current - Supply: 140µA Voltage - Supply: 2.7V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	pacchetto: -	Request a Quote	140µA	2.7V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	32-VFQFN Exposed Pad	32-HVQFN (5x5)
MVR5510AMBANESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS6528NAER2	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33PF8100CFESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
PCA9421BSZ	NXP	IC PMIC HVQFN24 Applications: Microcontroller, MCU Current - Supply: 5.5µA Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (3x3)	pacchetto: -	Azione4.200	5.5µA	3.3V ~ 5.5V	-40°C ~ 85°C (TA)	Surface Mount	24-VFQFN Exposed Pad	24-HVQFN (3x3)
MFS2323BMBA5EPR2	NXP	IC Applications: System Basis Chip Current - Supply: 30µA Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	30µA	5.5V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MFS8621BMBA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	pacchetto: -	Request a Quote	-	4.5V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount	48-VFQFN Exposed Pad	48-QFN (7x7)
MFS2630AMBA0AD	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	pacchetto: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MFS2633AMDA0AD	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: System Basis Chip Current - Supply: 29µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	pacchetto: -	Request a Quote	29µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC34PF4210A2ESR2	NXP	PF4210 Applications: Audio, Video Current - Supply: - Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	pacchetto: -	Request a Quote	-	2.8V ~ 4.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
MPF5200AMBA3ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-PowerWFQFN Supplier Device Package: 32-HWQFN (5x5)	pacchetto: -	Request a Quote	-	-	-	Surface Mount, Wettable Flank	32-PowerWFQFN	32-HWQFN (5x5)
MFS2320BMBB1EPR2	NXP	IC Applications: System Basis Chip Current - Supply: 30µA Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	30µA	5.5V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MPF5024CVNA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 4 Applications: High Performance i.MX 8 Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-VFQFN Exposed Pad	40-HVQFN (6x6)
MFS8631BMDA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	pacchetto: -	Request a Quote	-	4.5V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount	48-VFQFN Exposed Pad	48-QFN (7x7)

MC33FS6517NAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC34VR500VBES

NXP

REGULATOR, BUCK, QUAD WITH UP TO

Applications: Processor
Current - Supply: 297µA
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

pacchetto: -

Request a Quote

297µA

2.8V ~ 4.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

MC34VR500VAES

NXP

REGULATOR BUCK QUAD WITH UP TO 4

Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

pacchetto: -

Request a Quote

15mA

2.8V ~ 4.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

MC33FS6518CAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC34VR500V9ES

NXP

REGULATOR BUCK QUAD WITH UP TO 4

Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

pacchetto: -

Request a Quote

15mA

2.8V ~ 4.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

MFS2622AMBA0ADR2

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: -

Request a Quote

30µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MFS2621AMDABADR2

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: -
Current - Supply: -
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: -

Request a Quote

-

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC33FS6517CAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33PF8100F3ES

NXP

POWER MANAGEMENT IC, I.MX8, PRE-

Applications: Processor
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

10µA

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS8510A0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS8610BMBA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

Request a Quote

-

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MC33PF8200D2ESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MPF5024CVNA0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

Applications: High Performance i.MX 8 Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

pacchetto: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-VFQFN Exposed Pad

40-HVQFN (6x6)

MWCT1012VLFR

NXP

32BIT 64K FLASH 2KB FLEX

Applications: Wireless Power Transmitter
Current - Supply: 1.7mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

pacchetto: -

Request a Quote

1.7mA

3V ~ 3.6V

-40°C ~ 105°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

MFS5600AMEA0ESR2

NXP

DUAL 36V AUTOMOTIVE DC-DC CONTRO

Applications: -
Current - Supply: 140µA
Voltage - Supply: 2.7V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

pacchetto: -

Request a Quote

140µA

2.7V ~ 36V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

32-VFQFN Exposed Pad

32-HVQFN (5x5)

MVR5510AMBANESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS6528NAER2

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33PF8100CFESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

PCA9421BSZ

NXP

IC PMIC HVQFN24

Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (3x3)

pacchetto: -

Azione4.200

5.5µA

3.3V ~ 5.5V

-40°C ~ 85°C (TA)

Surface Mount

24-VFQFN Exposed Pad

24-HVQFN (3x3)

MFS2323BMBA5EPR2

NXP

IC

Applications: System Basis Chip
Current - Supply: 30µA
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

Request a Quote

30µA

5.5V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MFS8621BMBA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

pacchetto: -

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-

4.5V ~ 36V

-40°C ~ 125°C (TA)

Surface Mount

48-VFQFN Exposed Pad

48-QFN (7x7)

MFS2630AMBA0AD

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: -

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30µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MFS2633AMDA0AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: System Basis Chip
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: -

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29µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC34PF4210A2ESR2

NXP

PF4210

Applications: Audio, Video
Current - Supply: -
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

pacchetto: -

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-

2.8V ~ 4.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

MPF5200AMBA3ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-PowerWFQFN
Supplier Device Package: 32-HWQFN (5x5)

pacchetto: -

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-

Surface Mount, Wettable Flank

32-PowerWFQFN

32-HWQFN (5x5)

MFS2320BMBB1EPR2

NXP

IC

Applications: System Basis Chip
Current - Supply: 30µA
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

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30µA

5.5V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MPF5024CVNA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

Applications: High Performance i.MX 8 Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

pacchetto: -

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-

2.5V ~ 5.5V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-VFQFN Exposed Pad

40-HVQFN (6x6)

MFS8631BMDA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

pacchetto: -

Request a Quote

-

4.5V ~ 36V

-40°C ~ 125°C (TA)

Surface Mount

48-VFQFN Exposed Pad

48-QFN (7x7)