Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC OTP 2MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.080 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 2MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione15.432 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.760 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.608 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione7.232 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione4.528 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.184 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.320 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.464 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.848 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione6.592 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione2.544 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.568 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.584 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.288 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.344 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione2.592 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione4.144 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.192 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.304 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.592 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.336 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione6.928 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione5.456 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.152 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.824 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.192 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.784 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |