Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC OTP 1MBIT 150NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione2.416 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione7.792 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.872 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.944 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.864 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.264 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione5.696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione5.088 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.848 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.360 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione9.264 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione7.328 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione9.588 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.760 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione9.840 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.944 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.224 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.544 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.784 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione4.992 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione5.456 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione88.404 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione10.116 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione8.880 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione15.816 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |