Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC OTP 1MBIT 150NS 40VSOP
|
pacchetto: 40-TFSOP (0.488", 12.40mm Width) |
Azione3.360 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione5.360 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione46.200 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.944 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 1MBIT 150NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione105.564 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 1MBIT 120NS 40VSOP
|
pacchetto: 40-TFSOP (0.488", 12.40mm Width) |
Azione4.896 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 40VSOP
|
pacchetto: 40-TFSOP (0.488", 12.40mm Width) |
Azione3.552 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione4.896 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione15.600 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.488 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 1MBIT 120NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.816 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.568 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.632 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32SOIC
|
pacchetto: 32-SOIC (0.445", 11.30mm Width) |
Azione4.384 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32SOIC
|
pacchetto: 32-SOIC (0.445", 11.30mm Width) |
Azione4.368 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione5.328 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.296 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.208 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.064 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32SOIC
|
pacchetto: 32-SOIC (0.445", 11.30mm Width) |
Azione3.552 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32SOIC
|
pacchetto: 32-SOIC (0.445", 11.30mm Width) |
Azione2.960 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione7.952 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione3.424 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.616 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.160 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.272 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione18.192 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32SOIC
|
pacchetto: 32-SOIC (0.445", 11.30mm Width) |
Azione4.144 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |