Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.856 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.120 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.360 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.384 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione3.392 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione6.400 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.584 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione12.912 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione9.108 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione2.112 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.384 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.784 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione4.368 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.048 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.392 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione18.696 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.144 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.472 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.176 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione5.872 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione17.004 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione198.144 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione667.596 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione25.836 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione45.384 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.128 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.104 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |