Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 4MBIT 250NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione10.068 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 250NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione18.360 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 200NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.688 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 200NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.456 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.320 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 1MBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.296 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.344 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.696 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione2.544 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione20.256 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.848 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.832 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione7.872 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.008 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.320 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.032 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.368 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.184 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.688 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione21.420 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.440 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.344 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione3.280 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.568 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione96.000 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.656 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione3.008 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.824 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |