Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 64KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.304 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.536 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione252.120 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione324.564 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione13.620 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione16.500 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.784 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione3.280 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.512 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.936 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione4.560 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione5.376 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.704 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.448 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione5.280 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.544 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.944 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione108.300 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione14.880 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione78.516 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.680 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione31.164 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione5.408 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione15.168 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione24.252 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione172.500 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 24DIP
|
pacchetto: 24-DIP (0.600", 15.24mm) |
Azione38.856 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 24DIP
|
pacchetto: 24-DIP (0.600", 15.24mm) |
Azione13.872 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |