Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EPROM UV 8MBIT 90NS 32CDIP
|
pacchetto: 32-CDIP (0.600", 15.24mm) Window |
Azione5.888 |
|
EPROM | EPROM - UV | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.808 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EPROM UV 8MBIT 120NS 32CDIP
|
pacchetto: 32-CDIP (0.600", 15.24mm) Window |
Azione33.456 |
|
EPROM | EPROM - UV | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
||
Microchip Technology |
IC OTP 4MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione3.584 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 4MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.696 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 4MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione10.836 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 4MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.544 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 2MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione7.904 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 2MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione98.316 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione3.152 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione30.648 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.480 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 512KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.720 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 512KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.064 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 4MBIT 150NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.832 |
|
EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 150ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 256KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.624 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.008 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 120NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.304 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 4MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.688 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 150ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 4MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.752 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 2MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.608 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 2MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.000 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.080 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.336 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 30CPGA
|
pacchetto: 30-BCPGA |
Azione6.080 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 30-BCPGA | 30-CPGA |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32FLATPACK
|
pacchetto: 32-CFlatpack |
Azione2.208 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 30CPGA
|
pacchetto: 30-BCPGA |
Azione5.600 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 30-BCPGA | 30-CPGA |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 30CPGA
|
pacchetto: 30-BCPGA |
Azione7.040 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 30-BCPGA | 30-CPGA |