Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 256KBIT 250NS 28PIN
|
pacchetto: 28-BCPGA |
Azione5.984 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28CPGA
|
pacchetto: 28-BCPGA |
Azione2.608 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28CPGA
|
pacchetto: 28-BCPGA |
Azione2.272 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
pacchetto: 32-CLCC |
Azione5.040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
pacchetto: - |
Azione3.664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione4.384 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
pacchetto: 32-CLCC |
Azione4.224 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32CLCC
|
pacchetto: 32-CLCC |
Azione3.088 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32CLCC
|
pacchetto: 32-CLCC |
Azione5.760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
pacchetto: - |
Azione4.240 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione4.960 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione2.480 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione7.584 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione5.168 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28PIN
|
pacchetto: 28-BCPGA |
Azione4.224 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28CPGA
|
pacchetto: 28-BCPGA |
Azione5.792 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
pacchetto: - |
Azione3.552 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
pacchetto: - |
Azione5.040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
pacchetto: - |
Azione2.880 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione2.256 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione2.624 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione3.248 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
pacchetto: - |
Azione3.136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
pacchetto: 32-CLCC |
Azione7.664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
pacchetto: - |
Azione7.152 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
pacchetto: 32-CLCC |
Azione7.136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
pacchetto: - |
Azione2.544 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
pacchetto: 32-CLCC |
Azione3.376 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |