Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 256KBIT 250NS 32CLCC
|
pacchetto: - |
Azione5.424 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32CLCC
|
pacchetto: 32-CLCC |
Azione4.208 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 32CLCC
|
pacchetto: 32-CLCC |
Azione5.376 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32CLCC
|
pacchetto: 32-CLCC |
Azione5.888 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28FLATPK
|
pacchetto: - |
Azione6.800 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione4.832 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
pacchetto: - |
Azione3.136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 32CLCC
|
pacchetto: - |
Azione3.232 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 32CLCC
|
pacchetto: - |
Azione2.560 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32CLCC
|
pacchetto: - |
Azione3.888 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 32CLCC
|
pacchetto: 32-CLCC |
Azione3.776 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32CLCC
|
pacchetto: 32-CLCC |
Azione5.104 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.616 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.584 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.824 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.680 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 64KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione85.656 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.584 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.152 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.440 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.464 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 4KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.984 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.208 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.368 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.984 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione3.120 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.704 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.288 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |