Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
PLL | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Divider/Multiplier | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
PROGRAMMABLE CLOCK CAPABLE OF PR
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.160 |
|
- | - | - | - | - | - | - | - | - | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLOCK BUFFER DIE
|
pacchetto: Die |
Azione7.280 |
|
Yes | Crystal | LVPECL | 1 | 1:2 | No/No | 800MHz | Yes/No | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER DIE
|
pacchetto: Die |
Azione7.872 |
|
Yes | Crystal | LVPECL | 1 | 1:2 | No/No | 250MHz | Yes/No | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER DIE
|
pacchetto: Die |
Azione4.448 |
|
Yes | Crystal | LVPECL | 1 | 1:2 | No/No | 800MHz | Yes/No | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLOCK BUFFER DIE
|
pacchetto: Die |
Azione6.368 |
|
Yes | Crystal | LVPECL | 1 | 1:2 | No/No | 250MHz | Yes/No | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLK BUFFER 32LQFP
|
pacchetto: - |
Azione4.704 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC FANOUT BUFFER 32LQFP
|
pacchetto: - |
Azione4.896 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SYNTHESIZER FREQ PROGR 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione12.144 |
|
Yes | Crystal | PECL | 1 | 1:1 | No/Yes | 800MHz | Yes/No | 3.135 V ~ 5.25 V | 0°C ~ 75°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
Microchip Technology |
IC CLOCK GEN 3.3V/5V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.640 |
|
No | ECL, PECL | Clock | 1 | 1:4 | Yes/Yes | 1GHz | Yes/No | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLOCK GEN 3.3V/5V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione63.960 |
|
No | ECL, PECL | Clock | 1 | 1:4 | Yes/Yes | 1GHz | Yes/No | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLOCK GEN 3.3/5V 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione13.116 |
|
No | ECL, PECL | Clock | 1 | 1:3 | Yes/Yes | - | Yes/No | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC VCXO 18MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.176 |
|
No | Crystal | LVCMOS, TTL | 1 | 1:1 | No/No | 18MHz | Yes/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.360 |
|
Yes with Bypass | Crystal | LVDS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.464 |
|
Yes with Bypass | Crystal | LVDS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.816 |
|
Yes with Bypass | Crystal | LVPECL | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.100 |
|
Yes with Bypass | Crystal | LVPECL | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.344 |
|
Yes with Bypass | Crystal | LVPECL | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.544 |
|
Yes with Bypass | Crystal | LVPECL | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK ZDB 1:5 220MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.072 |
|
Yes with Bypass | Clock | Clock | 1 | 1:5 | No/No | 220MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
SYNTHESIZER MODULE
|
pacchetto: - |
Azione3.616 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SYNTHESIZER MODULE
|
pacchetto: - |
Azione7.888 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SYNTHESIZER MODULE
|
pacchetto: Module |
Azione3.632 |
|
Yes | Crystal | HCSL | 1 | 1:5 | No/Yes | 100MHz | Yes/No | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | Module | 38-LGA (5x7) |
||
Microchip Technology |
SYNTHESIZER MODULE
|
pacchetto: Module |
Azione4.496 |
|
Yes | Crystal | HCSL | 1 | 1:5 | No/Yes | 100MHz | Yes/No | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | Module | 38-LGA (5x7) |
||
Microchip Technology |
SYNTHESIZER MODULE
|
pacchetto: 38-SMD Module |
Azione7.120 |
|
Yes | Crystal | HCSL | 1 | 1:5 | No/Yes | 156.25MHz | Yes/No | 2.5V, 3.3V | -40°C ~ 85°C | Surface Mount | 38-SMD Module | 38-LGA (5x7) |