Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
PLL | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Divider/Multiplier | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER LVPECL 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione2.992 |
|
Yes | Crystal | LVCMOS, LVDS | 1 | 1:1 | No/Yes | 640MHz | Yes/Yes | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER LVPECL 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.704 |
|
Yes | Crystal | LVCMOS, LVDS | 1 | 1:1 | No/Yes | 640MHz | Yes/Yes | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER LVPECL 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.896 |
|
Yes | Crystal | LVCMOS, LVDS | 1 | 1:1 | No/Yes | 640MHz | Yes/Yes | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER LVPECL 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione27.156 |
|
Yes | Crystal | LVPECL | 1 | 1:1 | No/Yes | 640MHz | Yes/Yes | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER LVPECL 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione5.296 |
|
Yes | Crystal | LVCMOS, LVDS | 1 | 1:1 | No/Yes | 640MHz | Yes/Yes | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER LVPECL 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.704 |
|
Yes | Crystal | LVCMOS, LVDS | 1 | 1:1 | No/Yes | 640MHz | Yes/Yes | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 65MHZ PECL 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.648 |
|
No | Crystal | LVPECL | 1 | 1:1 | No/Yes | 65MHz | Yes/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 700MHZ CMOS 16QFN
|
pacchetto: - |
Azione7.296 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC PLL PROG CLOCK 16QFN
|
pacchetto: - |
Azione3.376 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16QFN
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.592 |
|
Yes with Bypass | Crystal | LVDS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione7.952 |
|
Yes with Bypass | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.896 |
|
Yes with Bypass | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 250MHZ 6SOT23
|
pacchetto: SOT-23-6 |
Azione3.696 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 250MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 250MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.648 |
|
Yes | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 250MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 25MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.608 |
|
Yes | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 25MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 6SOT23
|
pacchetto: SOT-23-6 |
Azione7.984 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 125MHz | No/No | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 6SOT23
|
pacchetto: SOT-23-6 |
Azione7.504 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 125MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.872 |
|
Yes | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 125MHz | No/No | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.488 |
|
Yes | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 125MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 100MHZ 6SOT23
|
pacchetto: SOT-23-6 |
Azione2.384 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 100MHz | No/No | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 156.25MHZ 6SOT23
|
pacchetto: SOT-23-6 |
Azione5.952 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 156.25MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 200MHZ LVPECL 16TS
|
pacchetto: - |
Azione4.592 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 200MHZ CMOS 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.648 |
|
Yes | Crystal | CMOS | 1 | 1:1 | No/No | 200MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 100MHZ CMOS 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.184 |
|
Yes | Crystal | CMOS | 1 | 1:1 | No/No | 100MHz | No/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 100MHZ CMOS 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.984 |
|
Yes | Crystal | CMOS | 1 | 1:1 | No/No | 100MHz | No/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 200MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.944 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:2 | No/Yes | 200MHz | No/Yes | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 25MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.752 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:2 | No/Yes | 25MHz | No/Yes | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER MULT OUT 6SOT23
|
pacchetto: SOT-23-6 |
Azione7.904 |
|
No | LVCMOS, Sine Wave, Crystal | LVCMOS | 1 | 1:3 | No/No | 52MHz | No/No | 1.8 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6L |